PEC电子工程英语证书考试-半导体词汇汇总.doc

PEC电子工程英语证书考试-半导体词汇汇总

1号极限开关
LS1(limit suitch 1)
232 bus的使用寿命已到或线路短路或断路
232 bus error
488 bus的使用寿命已到或线路短路或断路
488bus error
5S(整理、整顿、清扫、清洁、修养)
5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke)
5u之pp质滤心
cartridge p.p 5u
ABC分类法
ABC classification
AUTO模
automatic molding system
A板
A plate
BT指示剂
eriochrome black t indicator
B板
B plate
CO2气泡机
CO2 bubbler
DIP 产品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒收
Any device having a chip out greater than 0.5mm in width (or depth) and 1.25mm in length is rejectable.
DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP为0.15mm)。
The product is rejectable when pad support protrudes more than 0.25mm from the end of the package body.(sop:0.15mm).
DIP：不符合脚量规之脚弯拒收。
Any device showing bent leads (in case of doubts use the applicable gauge) is rejectable.
DIP：不均匀的镀层表面，使得小脚厚度大于0.4mm或宽度大于0.5mm或大脚以上厚度大于0.75mm，拒收。
Non-uniform solder such that a lead exceeds the dimensions of 0.4mm thick and 0.5mm wide below the seating plate, or an overall thickness of 0.75mm above the seating plane is rejectable.
DIP：从脚尖端到肩膀弯脚处，脚的镀层表面须均匀且连续。
Lead finish on the leads shall be smooth and continuous from lead tip up to and over bend of lead.
DIP：顶出孔不得高于胶体面或低于胶体表面0.5mm。
Ejector marks more than above the surface or more than 0.5mm below the surface of the device is rejectable.
DIP：离胶体0.5mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。
Lifting, peeling or flaking of the lead finish is rejectable excluding 0.5mm from the body.
DIP：小脚上不得有任何外来物造成之沾污。大脚上不得有大于0.15mm直径圆面积之沾污。
Package leads shall be free from attached foreign material except for foreign material located above the seating plane of the lead, not bigger than 0.15mm in diameter.
DIP：由于冲切造成之支持棒残存凸出或大脚凹陷大于0.25mm拒收。
Any lead with dam bar step dimensions exceeding 0.25mm is rejectable.
Driver board的使用寿命已到或线路短路或断路
driver board error
EDTA-2NA 标准溶液
EDTA-2NA standard solution
Eprom的使用寿命已到或线路短路或断路
eprom error
KBS 94 混床树脂筒
leasing mix bed resin bottle, kbs 94
L/F存放架
stack loader
L/F放反将导致反弯脚。
Lead frame reverse will cause reverse bending.
L/F排放机
Lead Frame Auto Loader Machine
L/F用剥锡剂 TLS-85a
solde stipper for plastic package,TLS-85a
L/F用剥锡剂 TLS-85b
solde stipper for plastic package, TLS-85b
L/F用剥锡剂 TLS-86
solder stipper for plastic package,TLS-86
L形尾塞
end plug (L)
L型尾塞
end plug(L)
MPU的使用寿命已到或线路短路或断路
MPU error
N2流量
nitrogen gas flow rate
OC曲线
poprtation curve
P.P 打包袋
P.P Band
PDCA管理循环
PDCA（Plan-Do-Check-Action)
PIN1标示
PIN1 identification
PIN1标示要有且与规格所订的尺寸一致。
The PIN1 identification must be present and in accordance with the specified dimensions.
PP材质阳极袋
anode bag p.p.
QA允收章
QA mark
QFP用的塑胶承载盘
QFP plastic tray
RAM的使用寿命已到或线路短路或断路
RAM read/write error即RAM error
SOP：不均匀的镀层表面，使得脚的宽度大于0.5mm或脚厚度大于0.25mm。
Non-uniform lead finish such that a lead exceeds the specified dimensions 0.5mm or leadl thickness exceeds 0.25mm is rejectable.
SOP：产品边缘上的裂角宽或深大于0.2mm，长大于0.6mm或露出体材料拒收。
Any devices having a chip out greater than 0.2mm width(or depth) and 0.6mm in length or exposed lead frame material is rejectable.
SOP：顶出孔低于胶体表面0.2mm，或是高于胶体表面拒收。
Ejector marks more than above the surface or more than 0.2mm below the surface of the device is rejectable.
SOP：脚浮不得超过0.1mm。
Lead coplanarity shall be within 0.1mm of one another in the vertical direction.
SOP：脚上不得有任何外务物之沾污，但如果是废胶则不能大于50％脚宽为直径的圆面积。
Leads shall be free attached foreign material, flash shall not exceed 50% of the lead surface.
SOP：离胶体0.2mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。
Lifting, peeling or flaking of the lead finish is rejectable excluding 0.2mm of the lead length from body.
SOP：由于冲切造成之支持棒残存凸出或凹陷大于0.1mm时拒收。
Any lead with dam bar step dimensions exceeding 0.1mm is rejectable.
S形尾塞
end plug (S)
XX部门经理
manager of XX department
XX电子有限公司
XX Electronics CO.Ltd
X管率
X-ray yield
X射线
X-ray
X-射线检验
X-ray inspection
安全光幕
safety curtain
安全库存量
safety stock
安全眼镜
safety glasses
氨水
ammoniam water
按下紧急按钮。
Press the emergency button.
按需订货
lot for lot
昂球
lifted bond
昂楔
lifted wedge
凹模
cavity plate,cavity block
百万分之一
PPM (parts per million)
柏拉图
Pareto chart
板状模组模具
plate mold
半导体
semiconductor
半球
insufficient ball size
半自动框架输送机
off loader
包反
wrong orentation molding
包反
wrong orientation molding
包封
molding
包封
molding
包封模具
mold chase
包封模具
mold chase
包封偏差
molding mismatch
包装
packing
包装
packing
包装盒(内箱)
packing box
包装盒缺点
packing defect criteria
包装外箱
shipping box
保管费
carrying cost
保管费率
carrying cost rate
保险期
safety time
保压时间
holdup time
保质期
shelf life
报废
scrap
备注
remark
背金/银
backside metal (Au/Ag)
背面
back side
背面打印
back marking
崩角
chip package
崩碎
chips
比重
specific gravity
比重
specific gravity
比重计
hydrometer
闭环物料需求计划
closed loop MRP
闭模时间
closing time
边筋翘起
bending side rail
边晶
edge die
边晶
reject die around slice edge
边框
side rail
边沿芯片
edge die
编带
Tape & Reel
编带
tape/real
编带拉力测试
peel back force test
编织层
braid
扁平电缆
flat cable,ribbon cable
扁球
flat ball
变差
variation
变色
discoloration
变色（发黄，发黑，发花，水渍，酸斑）
discolor(yellowish,blcken,water mark)
变色、氧化、浮起
discoloration/oxidation/lifting
变形
deformed
变形
deformed/distort
标杆瞄准
benchmarking
标签
label
标签、封装、QA允收章
defect criteria labelled boxes/seal/QA mark
标签内容错误
wrong contents on label
标签内容与内盒产品不符合
contents of label do not correspond with contents of box
标签位置不对、标签贴反
wrong location/orientation of label
标准
criteria
标准操作程序（作业指导书）
SOP（Standard Operating Procedure）
标准产品成本
standard product cost
标准单位运转工时
standard unit run hour
标准工资率
standard wage rate
标准机器设置工时
standard set up hour
表面安装
surface mounting
表面粗糙
dull finish / rough surface
表面贴装式
surface mount technology(SMT)
表面污染
surface contamination
别忘了在不良产品上作记号
Don't forget to mark at NG products.
冰箱
refrigerator
冰柱状
icicle
丙酮
acetone
饼夹
Pellet Tong
波峰焊
wave soldering
玻璃棒
glass rod
玻璃转换温度
grass transition temperature
薄膜气泡
tape bubbles
薄片，锯齿状
flake
补焊
rebonding
补零
remanence fill
补足欠交
fill backorder
不得有任何金属层腐蚀
Ａny metallization corrosion is rejectable
不合格
ninconformity
不合格品
ninconformance
不活动报告
no action report
不良品
reject unit (RJ)
不良数管制图
P N chart
不相同盖印
different marking
不粘
Non-Stick
不正确的周期码
incorrect date code
布线错误
wrong bonding
布线图
bond diagram
步进夹子
index cliper
步骤
process/step
部分盖印
partial marking
擦痕
scratches
擦伤
scratches
擦锡
solder scrape
材料
material
材料清单
BOM（bill of material）
财务部
financial department(FD)
采购订单跟踪
purchase order tracking
采购订单价格
price purchase order
采购计划法
vendor scheduling
采购计划员
vendor scheduler
采购员
buyer
参数
parameter
残料率
scrap factor
残渣、废屑
residues
仓库库位类型
inventoty location type
仓位备注
location remarks
仓位代码
location code
仓位数量
quantity at location
仓位状况
location status
操作规程（操作说明书/操作手册）
operation manual
操作员
operator
测镀
sputtering
测浇口
edge gate
测克
pull test
测克拉力
pull test
测克拉力机
pull meter
测克异常报告书
abnormal report of pull test
测力计
force gauge
测量
measurement
测量内容
measure item
测量系统分析MSA
measure system analysis
测试
test
测试机诊断
test diagnostic
层
level
层流台
lamina flow
插孔
socket contact
查找和确认根本原因
Define & Verify Root Cause
差色剂
colorant
产量
through put
产品
product
产品（封装体）
package
产品长度
packqge length
产品结构树
production tree
产品控制
product control
产品宽度
package width
产品率
production rate
产品设计
package design
产品特殊特性
special product characteristic
产品外形测量
measure for package out-line
产品线
production line
产品在管中
products in tubes
产品在管中方向错误
wrong orientation of products in tube
产品质量先期策划和控制计划APQP
advanced product quality planning and control plan
厂际需求
interplant demand
超波膜
UV tape
超薄型四周平面式封装IC
TQFP thin quad flat pack
超薄型缩小式海鸥翅膀型封装IC
TSOP thin small outline package
超期待烘产品烘烤及生产纪录
dry for overdue prduct of wait for molding and production record
超声波焊接
ultrasonic welding
超声波清洗机
ultrasonic clearing machine
超音波功率
bond power
超音波清洗
F/S finesonic clean
车床
engine lathc
车间作业管理
shop floor control
尘粒
particle
尘粒计数器
particle counter
尘流台
laminar flow
沉淀物
precip itate
成份
composition
成型
forming
成型角度
foot angle
承载架
carrier
承载架剥锡剂 BS-89
belt stripper,bs-89
程序
procedures
尺寸控制计划（动态控制计划）
DCP dimension control plan(dynamic control plan)
齿条
anti bar
充压
air compressed
冲床
punch machine
冲杆头
plunger tip
冲杆压强
transfer pressure
冲胶
D/J
冲胶杆
plunger
冲胶劲
transfer pressure
冲胶时间
transfer time
冲胶式
transfer type
冲胶套筒
pot
冲胶压力
transfer pressure
冲切，成型模具
dieset
冲切不对称
dam bar dimension
冲塑
degate/dejunk
冲塑切中筋
dejunk trim
冲弯率
wire deflection rate
冲压车间
stamp workshop,press workshop
冲压模具
die
冲压速度
injection setting
冲圆
fan out
抽样
sampling
抽样计划
sampling plan
抽样数
sample size
抽样数
SS（Sample Size）
出货
shipping
出货
shipping
出货标签
shipping label
出货标签
shipping label
出货品管
OQC（Out-going Quality Control)
初始过程能力
preliminary process capability
除非共同的接点，否则焊线与焊线不可相交
Broken wire is rejctable.
储存干燥箱
store dry box
传统摸（单缸模）
conventional mold die
传位不良
index error
吹气位
blow position
吹气延时
high pressure blow time
纯水
deionized water (DI water)
纯铜散热片
Copper Heat Sink
次品率
yield lost
次要缺点
minor defect
次要缺陷
minor failure
粗糙面
rough surface
粗能力计划
rough-cut capacity planning
催化剂
curing agent
存储干燥箱
store dry box
措施信息
action message
错方向
wrong orientation
错模
offset
错模
offset mold
错位
molding mismatch
错字
wrong marking
达到库存
available stock
打凹
down set
打包带太松
P.P Band too loosen
打包机
packing machine
打不粘
Non-stick
打次
defect
打火棒
E.F.O.touch
打线速度
bonding speed
打线图
bond diagram
打印
marking
打印
marking
打印不良
illegible marking
打印偏移
marking off-center
打印字间距
mark character distance
大脚上镀不全面积大于小脚宽为为直径之圆面积，拒收
Non-wetting above seating plane>lead width is rejectable.
呆滞材料分析
excess material analysis
待检验产品
waiting for inspection
戴粉红色帽子的人就是领班
The foreman is the person who wears the pink hat.
单列直插式
single side lead insert
单面板
single sided board
单腔模具
single cavity mould
单位成本
unit cost
单元式制造
cellular manufacturing
单值
individual
弹坑
crater
弹匣
cassette/magazine
弹匣组
cassette set
弹性强度
flexural strength
弹性系数
flexural modulus
氮气
N2 /nitrogen
氮气柜
N2 cabinet
当一个产品其正面及反面分别表示不同类型时拒收。
When a device has top and bottom marking indicating different product type, it is rejectable.
刀痕毛刺
kerf chipping
刀片
punch
刀片
punch
导电袋
conductive bag
导电地垫
conductive floormat
导电管
conductive tube
导电海绵
conductive sponge
导电胶
epoxy
导电胶
epoxy
导电胶不足
insufficient epoxy
导电胶不足
insufficient epoxy
导电胶裂缝
epoxy crack
导电胶气孔
epoxy void
导电性
conductive
导电桌垫
conductive table mat
导轨（流道）
workholder
导套
bushing
导线
wire
导柱
guide pin
导柱
post
导柱（标杆）
post
倒冲法
back flush
倒角
chamfer / touch up
倒序计划
back scheduling
倒装芯片
FC（Flip Chip）
倒装芯片
flip chip
登陆标志
MPS book flag MPS
低位码
low level code
低应力添加剂
low stree additive
滴定分析
titration analysis
底针板
ejector plate
地板
building floor
第1脚记号
pin 1 dot
第二点球焊功率
2nd bond power
第二点球焊时间
2nd bond time
第二点球焊压力
2nd bond force
第二点脱落
second bond peel off
第一点球焊功率
1st bond power
第一点球焊时间
1st bond time
第一点球焊压力
1st bond force
第一点虚焊
1st bond non-stick
第一只脚
pin 1 indicator
点焊不完全在焊接脚的焊接区内（点斜边）
Bonds on thepackage post that are not completely within the boundaries of the package post is rejectable.
点焊尺寸（第二点焊球尺寸）
Tailless bonds on the die or package post that are less than 1.2 times or greater than 5.0 times the wires the wire diameter inwidth or are less than 0.5 times or greater 3.0 times the wire diameter inlength is rejectable.
点火器
spark gun
点浇口
pin-point gate
点胶
die coating
点胶步骤
procedure for chip coating
点胶机
chip coating machine
点胶缺点
chip coating defect
点胶污染
Dimensions contamination.
点胶一般缺点
Chip coating general defect.
点脱
lift stitch
点温计
digimite
碘标准溶液
iodine standard solution
电镀
plating
电镀
plating
电镀处理槽
plating tank
电镀流量
plating current
电镀线
plating line
电镀液添加剂 solderlux
plating solution additive,solderlux
电镀子良品
defective plated parts
电极
element
电加工设备
electron discharge machining
电解脱脂
electroltic degrease
电介质
dielectric
电控柜
control panel / electrical cabinet
电缆夹
cable clamp
电缆中导线的头数
ends
电流
electrical current
电脉冲车间
electric discharge process workshop
电脑辅助设计
CAD
电脑监控式压模机
PC control molding press
电性检验
EQC (electrical quality control)
电压
electrical voltage
电压
voltage
电源
power
电子档保存
e-copy / soft copy
电子可程式唯读记忆体
EPROM (erasable-programmable rom)
电子天平
micro balance
电阻的温度系数
temperature coefficient of resistance
电阻质
volume resistivity
垫块真空孔
vacuum spacer
玷污（外来材料）
Contamination(foreign material)
淀粉指示剂
starch indicator
吊车
hoist
调机
machine buy off
调整现有库存量
adjust-on-hand
顶出孔
ejector marks
顶杆
ejector pin
顶孔
ejector pin hole
顶针
ejector needle/pin
顶针
ejector pin
顶针孔
E-pin hole(ejector pin hole)
顶针延时
ejector up delay
订单
PO（Purchase Order）
订单输入
order entry
订货备注
order remarks
订货承诺
order promising
订货点
order point
订货方针
order policy
定模
stationary mould,fixed mould
定模座板
top clamping plate,top plate,fixed clamp plate
定位，对准
alignment
定位不准
misalignment
定位环
locating ring
定位基准
datum reference
定位孔
location pin hole
定位孔
positioning hole
定位块
locator block
定位销
dowel
定位销孔
dowel hole
定位针
location pin
定型装置
sizing system
董事长
president
动模
movable mould,movable half
动模座板
bottom clamp plate,moving clamp plate
动态静态随机记忆体
DRAM,SRAM
动态试验
dynamic test
洞之直径大小，其允收的判定标准同与气泡（28.1)
For diameter requirements see table 28.1.
独立需求
independent demand
镀层剥落
solder peel off
镀层测厚
solder thickness test
镀层测厚仪
solder thickness meter
镀层厚度
plating thickness
镀层膜厚测试仪
coatign thicking gauge
镀层偏厚或偏薄
thick or thin plating
镀层气孔
solder void
镀层气泡
solder bump
镀架（挂具）
plating rack
端子
terminal
断刀检测
blade breakage detector (B.B.D)
断脚
broken lead
断脚
lead broken
断脚
broken lead
断丝
broken wire
断丝
broken wire
断线
wire broken
断字
broken character
断字
broken symbol
队列
queue
对300/400mil的产品在注入孔处的缺空,宽和深同时大于1.25mm时拒收;而600mil的产品,宽不得大于2.5mm,深不得大于1.25mm
The 300/400 mil devices having voids greater than 1.25mm in width and 1.25mm in depth on the injection gate area are rejectable.any 600 mil devices having voids greater than 2.5mm in width ang 1.25mm in depth on the injection gate area rejectable.
对不起，可以讲慢一点吗？
Excuse me,would you speak moe slowly?
多层印制电路
multilayer printed circuit
多方论证小组
CFT cross function team
多缸模
MGP(Multi Gang Pot) mold die
多浇口
multi-gating
多胶
excess expoxy
多晶模组D型种类IC
MCM-D mult chip module-D
多腔模具
multi-cavity mould
多余字
extra charactes
多重仓位
multiple location
额定电流
rated cuttent
额定电压
rated voltage
二极管
diode
发货
delivery
发货单
ship order
发货单联系人
ship contact
发货地址
ship address
发货零件
ship date
发货日期
date to pull
发料单
disbursement list
发票价格
price invoice
发送订单
issue order
发送零件
send part
阀门开关
valve
法兰、凸缘
flange
反查
pegging
反常需求
abormal demand
反面
bottom surface
反切
wrong orientation forming
反推杆
stopper
反应计划
rfaction plan
返工
rework
返工
rework
返修
repair
方差分析法
ANOVA analysis of variance
方铁
spacer plate
方向高度
reverse