耳机PCBA检验规范.docx

文件编号

生效日期
2015年5月10日
页次
共21页
耳机PCBA检验规范
版次
第一版

1、目的
本指导书旨在描述耳机PCBA的通用检验标准及产品验收相关要求，以作为我司及外协厂检验人员对耳机产品外观验收的依据，确保产品质量达到我司的质量要求。
2、使用范围
本检验指导书适用于耳机产品的整机外观检验，对有特殊工艺和特殊要求的产品，则依据具体的产品检验指导书检验。
3、使用指引
如有限度样,检验时优先考虑限度样，限度样包括整机上签署的限度样，以及物料上签署的限度样”
4、检验工具
直尺、游标卡尺、塞规、比对片、防静电手套或指套、防尘布、酒精、小刀，封箱胶布、透明胶带、
5、检验条件
视力：检验员视力要求不低于1.0(含矫正视力)；
距离：人眼与被测手机表面的距离为300mm±50mm；
照明：冷白荧光灯（光源在检测者正上方），光照度为1000±200Lux；
温度：15-35℃；
湿度：20%-75%；
检视角度： 产品检视面与桌面成45度角，上下左右各转动45度（如下图）；

检视时间：10±5s（单一面），针对外观检验；最长检验时间15s。在15s检视，如果缺陷仍不可见，则此检视件可视为合格。
6、耳机PCBA抽样计划
检验项目
抽样计划
允收水准
外观/结构(包括耳机外观、定制信息检查)
GB2828.1-2003 正常一次抽样LEVEL II
致命缺陷(CR)：C=0
严重缺陷(MA)：AQL=0.65
轻微缺陷(MI)：AQL=1.0
7、术语与定义
7.1 缺陷严重程度定义
Defect Classification 缺陷等级定义
CR: Critical Defect 致命缺陷
产品对人身安全造成伤害或存在安全隐患，对客户财产构成威胁的缺陷。
MA: Major Defect严重缺陷
产品存在使用异常的缺陷，主要有以下七种缺陷：
1．功能缺陷影响正常使用。　
2．性能参数超出设计规格和国家标准。
3．混料
4．漏元件、配件及主要标识；
5．多出无关标识及其它可能影响产品性能的非关联物品。
6．包装存在可能影响产品形象的缺陷。
7．结构及外观方面让顾客难以接受的严重缺陷。
MI: Minor Defect次要缺陷
除CR、MA缺陷以外的其它不影响产品使用的缺陷。
Acc: Acceptable Defect可接受缺陷
可以接受的缺陷或无缺陷，出厂检查时供参考。
7.2 外观等级面定义
特级面：
一级面：
二级面：
三级面：正常使用时看不到面，如电池盖的内表面。
说明：整机结构件内表面外观缺陷如不影响产品性能下降和整机组装则不作管控。
若本标准存在任何与工程图有冲突之处，以工程图为准。
8、SMT 组件(SMT component)
8.1 焊点规格(Soldering spec.)
8.1.1 Chip零件移位(Chip component shift)
图 例
判 定 标 准

Side overhang (D) is greater than 25% component termination width (W) or 25% land width (P) whichever is less.-----Defect
零件上下平偏移 D>25%W或D>25%P 拒收
(任何一个条件满足,可拒收)

Side overhang (D) is greater than 25% component termination width (W) or 25% land width (P) whichever is less.-------Defect
零件旋转偏移 D>25%W或D>25%P 拒收
(任何一个条件满足,可拒收)

Termination overhangs land(B>0)------Defect
零件左右平偏移超出PAD(B>0) 拒收
L
l

Component overhangs 25% length of metallization terminal end (L) or
less than 0.25mm ------Defect
零件水平偏移l>25%L 或l>0.25mm 拒收

Component in reserved to lacquer to go to circuit to form a short circuit.------Defect
零件偏移在有保护漆的线路上造成短路 拒收

End joint width (C) is minimum 75% of component termination width (W) or 75% land width (P) ,whichever is less.---- Acceptable
零件偏移后焊点宽度 C>75%W 或是C>75%P 允收
(任何一个条件满足,可允收)
8.1.2 Chip零件多錫.少錫及錫不熔透(Chip component)
图 例
判 定 标 准

Maximum fillet height (E) may overhang the land or extend onto the top of the end cap metallization, but not extend further onto the component body.------Acceptable
锡多超过金属端,但末端没有延伸至零件本体. 允收

Solder fillet extends onto the component body.------Defect
锡延伸到零件本体上 拒收

圖1

圖2

1. Insufficient solder.-----Defect
少锡. 拒收 (图1)
2. Minimum fillet high(F) is less than 3/4 termination high(H) . ----Defect
上锡高度F<3/4H . 拒收 (图2)

Insufficient end overlap . -----Defect
移出焊盤 拒收

8.2.1圆柱体零件移位.(Cylindrical End Cap Termination)
图 例
判 定 标 准

Side overhang (A) is greater than 25% component diameter(W) or land width (P), whichever is less.------Defect
零件偏移 A>25%W或A>25%P 拒收
(任何一个条件满足,可拒收)
备注 ( W : 零件直径 P: 铜箔宽度 )

Any end overhang(B)-------Defect
零件偏移超出 PAD(B>0) 拒收

End joint width (C) is minimum 75% of component diameter (W) or 75% land width (P), whichever is less.------Acceptable
零件连接直径宽度 C≧75%W 或75%P 允收
(任何一个条件满足,可允收)
备注 ( W : 零件直径 P: 铜箔宽度 )
8.2.8圆柱体零件多锡.少锡及锡不熔透(Cylindrical End Cap Termination)

Side joint length(D) is minimum 75% length of component termination(T) or land length(S),whichever is less.------- Acceptable
侧面焊点长度 D≧75%T或D≧75%S 允收
(任何一个条件满足,可允收)
备注 ( T : 零件的焊接端的宽度 )

Solder fillet extends onto the component body.------Defect
锡延伸到零件本体上 拒收
8.3 Leadless chip或IC chip移位.少锡.上锡不良.(Leadless or IC chip)

Side overhang(A) exceeds 25% castellation width(W)----Defect
侧面偏移 A＞25%W 拒收

End joint width (C) is less than 75% castellation width (W)-----Defect
零件末端焊点宽度 C＜75%W 拒收

Minimum side joint length (D) is less than 50% minimum fillet height(F) or land length external to package(S), whichever is less.---- Defect
零件末端焊点长度 D＜50%F或50%S 拒收

End side length (l) is greater than 50% lead length (L)
is less.---- Defect
零件lead根部移出焊盘l>50%L 拒收
8.4 扁平.L型和翼型引脚移位.少锡.上锡不良.(Flat Ribbon, L, and Gull Wing leads)

Maximum overhang (A) is not greater than 25% lead width (W) ----Acceptable
侧面偏移 A≦25%W(组件脚宽度) 允收

Side overhang (A) is greater than 75% lead width (W) ----Defect
零件侧面偏移 A>75%W 拒收

Minimum end joint width (C) is less 75% lead width (W)-----Defect
焊点宽度 C＜75%W 拒收

Side joint length (D) is less than width (W) or 75% of lead length (L), whichever is less. ----Defect
焊点长度: D<W(组件脚宽度)或者D＜3/4L . 拒收
(任选一个条件满足,拒收)

Solder touches the body or end seal of high-lead configuration components.----Defect
焊锡延伸至零件本体上或封装末端 拒收

Transformer high voltage pin's solder is over the A corner portion, but ex no function pin (for all inverters, except special case)-----Acceptable
吃锡度已达到A处(第一弯脚处) 允收

Solder is not over the B portion(for all inverters, except special case)----Acceptable
吃锡度未超出B处 允收

Solder is already over the B portion----- Defect
吃锡度已经超出B处 拒收

Minimum heel fillet height (F) is equal to solder thickness(G) plus 50% lead thickness (T) at connection side . ---- Acceptable
焊点高度 F>50%T+G 允收
(上焊高度 (F)> 50%+G 组件脚厚度(T) (G)为锡浆厚度 ) 允收

8.5圆形或椭圆形引脚移位 少锡 上锡不良 (Round or Flattened (Coined) leads)

Side overhang (A) is greater than 25% lead width/diameter (W).-----Defect
零件偏移 A>25%W(组件脚宽度/直径) 拒收

Minimum end joint width (C) is less 75% lead width/diameter (W)-----Defect
焊锡宽度 C＜75%W . 拒收

Side joint length (D) is less than lead width/diameter----Defect
焊锡长度:D小于引脚宽度/直径. 拒收
(可参考 4.扁平.L型和翼型引脚移位.少锡.上锡不良中”焊点长度”标准内容)

Solder touches the package or end seal.----Defect
焊锡延伸至零件本体上或封装末端. 拒收

Minimum side joint height (Q) is less than solder thickness(G) plus 75% diameter (W) of round lead or 75% thickness of lead at joint side (T) for coined lead.----Defect
焊锡高度 Q<G+75%W 或 Q<G+75%T. 拒收
8.6 J型引脚移位.少锡.上锡不良.(J Leads)

Side overhang (A) is greater than 25%W -----Defect
偏移宽度 A>25%W 拒收

Minimum end joint width (C) is greater than75% lead width (W)-----Acceptable
焊锡宽度 C≧75%W 允收

Side joint fillet (D) less than 150% lead width---Defect
焊锡宽度 (D)小于150%引脚宽度(W) 拒收

Side joint fillet touches package body----Defect
焊锡延伸到零件本体上 拒收
8.7 I型引脚移位.少锡.上锡不良.(Butt/I Joints)

Any toe overhang(B)----Defect
零件侧边偏移超出PAD (B>0) 拒收

End joint width (C) is less than 75% lead width (W)----Defect
焊锡宽度 C<75% W 拒收

Solder touches package body----Defect
焊锡延伸至零件本体上 拒收

Fillet height (F) is less than 0.5mm[0.02in]-----Defect
焊锡高度 F<0.5mm 拒收
8.8向内J型引脚移位.少锡.上锡不良.(Inward Formed L-Shaped Ribbon Leads)

End joint width (C) is less than 75% lead width (W).-----Defect
焊锡宽度 C<75%W 拒收
Side overhang (A) is greater than 25%W.-----Defect
偏移宽度 A>25%W 拒收
Minimum fillet height (F) is less than 50%E.-----Defect
焊锡高度 F<50%E 拒收

Minimum end joint width (C) is 75% lead width (W)----Acceptable
焊锡宽度 C≧75%W 允收
8.9 BGA零件移位.少锡.上锡不良.(Area Array/Ball Grid Array)

More than 50% overhang-----Defect 偏移>50% 拒收
Acceptable-class1,2,3 --- less than 25% overhang . (接收偏移水平<25%)
Process indicator-class2,3 --25~50% overhang. (加工可收偏移水平: 25~50%)
Defect-class1,2,3--more than 50% overhang.(不接收偏移水平>50% )

Solder bridge. 短路(锡桥)
Dark spots in x-ray view that bridge between solder joints.
在X-ray下之焊点间桥接
Solder open. 假焊(锡散开) Missing solder. 漏焊
Solder balls(S) that bridge more than 25% of the distance between the leads.----Defect 锡珠直径>25%的焊点间距(两焊球之间距) 拒收.

Fractured solder connection.-----Defect
锡裂 拒收
9.焊点异常(Soldering abnormal)
9.1 零件侧立(component mounted on side)
图 例
判 定 标 准

Component mounted on side .--- Defect
零件侧立. 拒收
9.2 零件反面(component reverse)

Element of chip component with exposed deposited electrical element is mounted toward board---Defect
零件反面. 拒收
9.3 组件竖起（Tombstone)

Chip components standing on their terminal end (tombstoning).-----Defect
组件竖起(墓碑) 拒收
9.4 共平面(组件翘起)(Coplanarity )

One lead or series of leads on component is out alignment and fails to make proper contact with the land.------Defect
组件的一个或多个脚变形,不能与PAD正常接触(造成假焊). 拒收
9.5 锡不熔透（incomplete melting of solder ）

Incomplete melting of solder.-----Defect
锡未完全熔化.(锡点表面粗糙,不光滑,或显颗粒状) 拒收
9.6 假焊（open solder)

Solder has not wetted to the land or termination.-----Defect
焊盘浸润不良造成组件金属端与焊盘脱落(假焊).
9.7 锡裂(Fractured solder)

Fractured or cracked solder.----Defect
焊锡断裂或破裂 拒收
9.8 锡孔(solder hole)

Blowholes, pinholes, voids, etc.----Defect
锡孔直径超0.2mm或孔深可见零件脚. 拒收
9.9 锡渣(Solder splash)

Solder splashes .----Defect
锡渣 拒收

9.10 锡尖(Icicle solder)

Icicle Solder is less than 0.5mm of the distance near by component -----Defect

焊点上有锡尖,长度靠近相邻近组件少于0.5mm 或影响高频特性不能按受的. 拒收

9.11 锡桥(短路) (Solder bridge)

1. A solder connection across conductors that should not be joined.-----Defect
锡桥(短路) 拒收
2. A solder connection across conductors that should be joined .but the conductors are the same that PAD.----Acceptable
同PAD PIN 锡桥(短路) 允收
3. On the same trace (visualable) but not same PAD, solder bridge (short) across conductors.----Acceptable
目视同线路不同PAD短路 允收
9.12 零件反向&极性错 (wrong polarity)
PCB板上的向点
方向点

Wrong polarity ------- Defect
零件反向&极性错. 拒收 (IC等有极性的组件)
9.13 漏料&多料(component missing &component in excess)
多料
漏料

Component Missing &Component In Excess ------ Defect
漏料&多料. 拒收
9.14 连接器/排插(Connector)

1. Will not mate when used in application due to angle. --- Defect
排插歪斜,组装时不能配合. 拒收.
2. Component violates height requirements. ----Defect
组装高度能超过产品最高要求. 拒收
3. Component required to be mounted above the board surface are not less than 0.5mm. ---- Defect
零件底面距离PCB板距离 H>0.5mm . 拒收
9.15 零件不贴板(gap between component and PCB)
H

Component required to be mounted above the board surface are not less than 0.3mm. ---- Defect
零件底面距离PCB板距离 H>0.3mm . 拒收
9.16 锡珠(Solder ball)

1. Solder ball dislodge---Defect
不允许非附着性锡珠 拒收
2. Entrapped or encapsulated solder balls that are exceed 0.125mm in diameter.----Defect
附着性锡珠但锡珠直径大小为0.125mm(含) 以上 拒收
3. Solder ball attached on high voltage side of transformer or around high voltage capacitor----Defect
变压器高压端及高压电容旁有附着性锡珠 拒收
4. More than 5 solder balls (diameter less than 0.125mm)
per 25.4mm(length)&per 600mm2 ----Defect
锡珠直径大小为0.125mm以下,但锡珠数量多于5颗/600mm2(含) 或多于5颗/25.4mm 拒收
PS:锡珠以静电毛刷刷不掉者,判为附着性锡珠.

10.零件损坏(物料不良)(Component damage)
10.1 裂缝与缺口(Gracks and chip-outs)

Nicks or chip-outs not greater than dimension l<25%L,w<25%W,t<0.15mm ----Acceptable
缺口的尺寸L<25%L,w<25%W,t<0.15mm 可接受

1. Any nick or chip-out that exposes the electrodes. ----Defect
任何电极上的裂缝或缺口 拒收
2. Cracks, nicks or any type of damage bodied components. ----Defect
玻璃组件本体上的裂缝﹑刻痕或任何损伤 拒收
3. Any chip-outs in resistive elements. ----Defect
任何电阻质的缺口 拒收

Any cracks or stress fractures.----Defect
任何裂缝或压痕 拒收
10.2 金属镀层(Metallization)

Maximum of 25% of metallization loss of top end area (for each terminal end )---Acceptable
顶部金属镀层损失不大于25% 允收
侧面金属镀层不得漏底材

Metallization loss exceeds 25% of top area---Defect
顶部金属镀层损失大于25% 拒收
10.3 金属镀层剥落(metallization missing )

1. Leaching of the terminal end face exposing ceramic
镀层(上锡的金属端)剥落宽度,厚度超出25％W或25％T. 拒收
2. Leaching exceeding 25% of component width (W) or component thickness (T)-----Defect 端面露出零件的本体 拒收
11.PCB异常(PCB abnormal)
11.1 PCB铜泊氧化(PCB Pad oxidization)

PCB Pad oxidization ----- Defect
PCB板铜泊氧化. 拒收

11.2 PCB 破损/刮伤(PCB broken/crack)
A
A

1. 缺口已超过板边到导线间距所允许的50%,(不能伤及线路)或者 A≧2.54mm, 取两者的最小值. 拒收
2. 刮伤或伤及到线路以及露铜. 拒收
11.3 PCB 分层(PCB delamination)

1.A separation between any of the layers of the base material or between the base material and the metalcladding. ---- Defect
1.分层为PCB基板层间或基材与导电箔之间的分离现象. 拒收
2. 边缘分层产生的呈”泛白色区”超过规定边距的50% ,或者超出2.5mm .(如果对边距没有做规定的话). 拒收

11.4 PCB板变形 (PCB deform/distort)

1.Bow and twist after soldering exceed 0.7% length for PCB diagonal. length --- Defect
板弯曲高度(把PCB放在平台,板与平台的高度)超过板面对角长的0.7% . 拒收
2.Incoming material inspection: put PCB on flat type. fixed PCB three
point of edge for PCB. Bow and twist clearance over PCB thickness
--- Defect
来料检查:将PCB边沿三点固定在平台上,变形大于PCB厚度 拒收

11.5 PCB 起泡/通孔不良/插件孔等不良(PCB Bubble/through hole NG )

1. Any evidence of blistering/delamination between plated through holes or internal conductors. ----Defect
在导通孔或导电路之间,有任何明显的PCB板铜泊起泡或分层是不能接收的. 拒收
2. Through hole NG ----Defect
通孔不良. 拒收
3. DIP hole NG ---- Defect
插件孔不良 . 拒收

11.6 PCB表面脏污(PCB surface dirty)

1. All of dirty not come from PCB itself (such as ink mark &dust etc. ----Defect
PCB表面脏污(如:不良油印,异物等) 拒收

11.7 补绿油(Repaired with Green mask)

1. PCB surface repair with green mask. ----Defect
PCB表面被绿油修补. 拒收

11.8 PCB擦伤(PCB surface scratch)

1. PCB surface electric road scratch. ----Defect
PCB表面电性线路擦伤. 拒收

11.9 丝印不良(silk print abnormal )

1. PCB surface silk print abnormal (such as: not cleaning, shift etc.). ----Defect
PCB表面丝印不清 偏位等. 拒收

11.10 Via孔堵塞(Via hole tamp )

1. Via hole tamp----Defect
Via 通孔堵塞. 拒收

11.11 通孔/定位孔裂开(though hole/orientation hole broken )

1. PCB though hole/orientation hole broken. ----Defect
PCB定位孔/通孔开裂. 拒收

11.12 Via孔偏移(Via hole shift )

1. Via hole shift----Defect
Via通孔偏位. 拒收

11.13.露铜(exposed Cu )

1. PCB edge side or PCB surface exposed Cu----Defect
PCB侧边或PCB表面露铜. 拒收

11.14 Via孔电镀不良(Via hole tinning NG )

1. Via hole tinning NG----Defect
Via通孔电镀不良. 拒收

12、流程图
无
13、支持性文件
《进料检验检验规范》；        
《PCBA进料检验指导书》；  
14、附件
附件一:IQC来料检验流程图 
附件二:IQC来料不合品处理流程图

NG
填写记录
OK
仓库物料待检区
检验
评审
IQC粘贴不良标签
NG
OK
物料来料检验规范
来料检验报告
物料特采单
来料送检单
供应商
部门
供应商送货单
文件表单
品质部、仓库
IQC来料检验流程图（附件一）
品质
品质部
仓库
入库单
来料
入库
退料

品质部
品质部
NG
安排相关人员挑选
填写记录
填写记录
IQC粘贴特采标签
特采
OK
物料来料检验规范
来料检验报告
物料特采单
来料检验报告
供应商
部门
送检单
文件表单
品质部
IQC不良品处理流程（附件二）
供应商
品质部
仓库
退料单
不良品
入库
挑选
评审
退料
IQC检验
来料检验报告
填写记录、IQC粘贴挑选标签

核准：
审核
制定：
日期：2015年5月4日
东方酷音机密，未经许可不得扩散