ID2304D 高压半桥驱动芯片600V替代L6388

ID2304D Chipown High Side & Low Side Gate Drive ICGeneral description The ID2304D is a high voltage, high speed power MOSFET and IGBT driver based on P_SUB P_EPI process. The floating channel driver can be used to drive two N-channel power MOSFET or IGBT in a half-bridge configuration which operates up to 600 V. Logic inputs are compatible with standard CMOS or LSTTL output, down to 3.3V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. Propagation delays are matched to simplify use in high frequency applications. Application Small and medium-power motor driverPower MOSFET or IGBT driverHalf-Bridge Power ConvertersFull-Bridge Power ConvertersAny Complementary Driver ConvertersFeatures Fully operational to +600 V3.3 V and 5 V logic compatibledV/dt Immunity 50 V/nsecNegative VS Swing to -7 VGate drive supply range from 10 V to 18 V UVLO for high side & low side channelsOutput Source/Sink Current Capability 300 mA / 500mAMatched propagation delay for both channelsInternal dead time 120 ns typicalBuild-in bootstrap diodePackage/Order Information ID2304D87651234LOCOM LINHINVCC VBHO VSOrder code Package ID2304DSEC-R1 SOP8 Typical Application Circuit ID2304D8765CBS3214VDC, up to 600VLOCOM LINHINVCC VBHO VSMCURcs IF Q1Q2LoadCVCC15V深圳市骊微电子科技有限公司芯朋微一级代理商w w w .s z l w t e ch .co mID2304D Chipown Pin Definitions Pin Name Pin Number Pin Function Description LIN 1 Logic input for low side gate driver output (LO) HIN 2 Logic input for high side gate driver output (HO) VCC 3 Low side and main power supply COM 4 Ground LO 5 Low side gate drive output, out of phase with LIN VS 6 High side floating supply return or bootstrap return HO 7 High side gate drive output, in phase with HIN VB 8 High side floating supply Functional Block Diagram UVLODelayPulseGeneratorNoise filterRRSQUVLODriverDriver12453678Dead TimeHINLINCOMLOVCCVSHOVBVCCBootstrap Diode深圳市骊微电子科技有限公司芯朋微一级代理商w w w .s z l w t e ch .co mID2304D Chipown Package Information Package Information SOP8 DA3A2AA1LL1c0.25beBBE1EBASE METALSECTION B-BWITH PLATINGbb1c1 chSize Symbol Min.（mm） Typ. （mm） Max.（mm） Size Symbol Min.（mm） Typ. （mm） Max.（mm） A - - 1.75 D 4.70 4.90 5.10 A1 0.10 - 0.225 E 5.80 6.00 6.20 A2 1.30 1.40 1.50 E1 3.70 3.90 4.10 A3 0.60 0.65 0.70 e 1.27BSC b 0.39 - 0.48 h 0.25 - 0.50 b1 0.38 0.41 0.43 L 0.50 - 0.80 c 0.21 - 0.26 L1 1.05BSC c1 0.19 0.20 0.21 0 - 8 Top mark Package iDR. ID2304D YWWXXXXX SOP8 Note：Y：Year Code；WW：Week Code；XXXXX：Internal Code Notes: 1. This drawing is subjected to change without notice.2. Body dimensions do not include mold flash or protrusion.深圳市骊微电子科技有限公司芯朋微一级代理商w w w .s z l w t e ch .co mID2304D Chipown Important NoticeWuxi Chipown Microelectronics Co. Ltd. reserves the right to make changes without further notice to any products or specifications herein. Wuxi Chipown Microelectronics Co. Ltd. does not assume any responsibility for use of any its products for any particular purpose, nor does Wuxi Chipown Microelectronics Co. Ltd assume any liability arising out of the application or use of any its products or circuits. Wuxi Chipown Microelectronics Co. Ltd does not convey any license under its patent rights or other rights nor the rights of others. 深圳市骊微电子科技有限公司芯朋微一级代理商w w w .s z l w t e ch .co m