线路板术语手册样本.doc

资料内容仅供您学习参考，如有不当或者侵权，请联系改正或者删除。A- stage A阶段Abietic Acid 松脂酸Abrasion Resistance 耐磨性Abrasives 磨料,刷材ABS 树脂Absorption 吸收,吸入AC impedance 交流阻抗Accelerated(Aging) Test 加速试验,加速老化Acceleration 速化反应Accelerator 加速剂,速化剂Acceptability, Acceptance 允收性,允收Acceptable Quality Level(AQL) 允收质量水平 Access 存取,使用,接近,进入Access Hole 露出孔(穿露孔,露底孔)Accuracy 准确度Acid Copper Plating 酸性电镀铜Acid Dip浸酸Acid Number(Acid Value) 酸值Acoustic Microscope(AM) 感音成像显微镜Acrylic 压克力Actinic Light(or intensity ,or Radiation) 有效光Activation 活化Activator 活化剂Active Carbon 活性炭Active Parts(Components or Devices) 主动零件Acutance 解像锐利度Addition Agent 添加剂Additive Process 加成法Additives 添加剂Adhesion 附着力Adhesion Promotor 附着力促进剂Adhesive 胶类或接着剂Admittance 导纳Aerosol 喷雾剂,气溶胶,气悬体Agglomeration 凝絮Aging 老化Air Agitation空气搅伴Air Bearing空气轴承Air inclusion气泡夹杂Air Knife气刀,气廉Algorithm 算法Aliphatic Solvent 脂肪族溶剂Aluminium Nitride(AIN) 氮化铝Ambient Temp 环境温度Amorphous 无定形,非晶形Amp-Hour 安培小时Analog Circuit/Analog Signal 模拟电路/模拟讯号Anchoring Spurs 着力爪Angle of Attack 攻角Angle of Contact 接触角Anion 阳向游子(阴离子)Anisotropic 异向的,单向的Anisotropic Conductive Adhesive (ACA) 单向(垂直)导向胶Anisotropic Conductive Film (Adhesive)单向导电接着膜Anneal 韧化Annular Ring 孔环Anode 阳极Anode Sludge 阳极泥Anodizing 阳极化ANSI 美国标准协会Anti-foaming Agent 消泡剂Anti-pad 空圆,隔离空垫Anti-pit Agent 抗凹剂Any Layer interstitial Via Hole(ALIVH) 阿力夫制程AOI 自动光学检验Apertures开口,钢版开口,光束出口AQL 质量允收水平Aramid 聚酰胺树脂Aramid Fiber 聚酰胺纤维Arc Resistance 耐电弧性Area Array Package 面积格列封装(组件)Array 格列,排列,数组,一排,一条,一套组合Artwork 底片As Received 到货,收货ASIC 特定用途的集成电路器Aspect Ratio 纵横比Assembly 装配,组装,构装Automatic Testing Equipment(ATE) 自动电测设备Attenuation 讯号衰减Autoclave 压力锅Auxiliary Anode(or Cathode) 辅助阳极(阴极)Availability 航空电子品Axial Lead 轴心引脚Azeotrope 共沸混合液B-stage B阶段Back Light(Back Lighting) 背光法Back Taper 反斜锥角Back-up 垫板Backpanels,Backplanes 背板,支撑板Bail Outqyi 勺出Balanced Transmission Lines 平衡式传输线Ball Grid Array 球脚数组(封装)Bandability 可弯曲性,弯曲能力Bandwidth 频带宽度,频宽Banking Agent 护岸剂Bar Chart 直方圆Bar Code条形码Bare Board 空板,未装板(大陆业称光板)Bare Chip Assembly裸体芯片组装Barrel 孔壁,滚镀Barrier 障凝层Base Material 基材Baseband Area 基频区Basic Grid 基本方格Batch 批Baume 波美度Beam Lead 光芒式的平行密集引脚Bed-of-Nails Testing 针床测试Bellows Contact 弹片式接触Bend Test 弯曲试验Beta Ray Backscatter 具她射线反弹散射Bevelling 切斜边Bias 斜张网布,斜织法Bi-level Stencil 双阶式钢版Binder 黏结剂Bipolar Electrodes 偶极性电极组Bits 头,针尖Black Oxide 黑氧化层Blanking 冲空断开Bleach 漂洗Bleeding 渗流Blind Via Hole 盲导孔Blister 局部性分层或起泡Block Diagram 电路系统整合图Blockout 封网Blotting 干印Blotting Paper 吸水纸,吸墨纸Blow Hole 吹孔Blue Plaque 蓝纹Blue Print 蓝图Bluetooth 蓝牙/蓝芽(短期无线通讯之整合技术)Blur Edge(Circle) 模糊边带,模糊边圈Bomb Sight 弹标Bond Strength 结合强度,固着强度Bondability 结合性,固着性Bonding Layer 结合层,固着层Bonding Sheet(Ply,Layer) 接合片,接着层Bonding Wire 结合线Bow,Bowing 板弯Braid 编线Brazing 硬焊Break Point 出像点,显像点,露铜点Breakaway Panel 可断开板Breakdown Voltage 崩溃电压Break-out 破出Bridging 搭桥,桥接Bright Dip 光泽浸溃处理Brightener 光泽剂Brown Oxide 棕氧化Brush Plating 刷镀Build-up 增厚,堆积,增层Build-up Multilayer(BUM) 增层法多层板Build-up Process 增层法制程Built-in 内建Bulge 鼓起,凸出Bulk Solution 主槽液,主体溶液Bump 突块,凸块Bumping 凸块封装技术Bumping Process 凸块制程Buoyancy 浮力Buried Capacitor (or Resistor) 埋入式(内建式)电容器(或电阻器)Buried Hole 埋通孔Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Bus Bar 汇电杆Butter Coat 外表树脂层By-product 副产品,副产物C-stage C阶段Controlled Collapse Chip Connection(C4 Chip Joint)C4芯片焊接Cable 电缆CAD 计算机辅助设计Calendered Fabric 轧平式网布Camcorder 摄录像(像)机Cap Lamination 帽式压合法Capacitance 电容Capacitive Coupling 电容耦合Capillary Action 毛细作用Capillary Direct Film(CDF) 毛细式直接版膜Capture Pad 微盲孔之外环,面环Carbide 碳化物Carbon Arc Lamp 碳弧灯Carbon lnk 碳胶,碳膜Carbon Treatment, Active 活性碳处理Card 卡板Card Cages, Card Racks 电路板构装箱Carlson Pin 卡式定位梢Carrier 载体Cartridge 滤芯Cascade Rinse 连续溢流式清洗Castallation 堡型集成电路器Catalyzed Board, Catalyzed Substrate (or Material)催化板材Catalyzing 催化Cathode 阴极Cathode Rod Agitation 阴极杆搅拌Cation 阴向游子,阳离子Caul Plate 隔板Cavitation 空泡化,半真空状态Cavity Down/Cavity Up 方凹区朝下或朝上Cell Phone 行动电话Center-to-Center Spacing 中间间距Ceramics 陶瓷Cermet 陶金粉Certificate 证明书CFC 氟氯碳化物Chamfer 倒角Characteristic lmpedance 特性阻抗Chase 网框Check List 检查清单Chelate 螯合,螯合剂,ChelatorChemical Milling 化学研磨Chemical Resistance 抗化性,耐化性Chemisorption 化学吸附Chip 晶粒,芯片,片状Chip Clearance 排屑间隙Chip Clogging 堵屑,塞屑Chip interconnection 芯片互连Chip On Board(COB) 晶板接装法Chip on Flex (COF) 芯片直接安装软板Chip On Glass (COG) 晶玻接装法(芯片对玻璃电路板的直接安装)Chip Scale Package 芯片级封装Chisel 錾刃Chlorinated Solvent 含氯溶剂,氯化溶剂Choline Hydroxide 瞻碱Circuitization 成线Circumferential Separation 环状断孔Clad/Cladding 披覆Clean Room 无尘室,洁净室Cleanliness 清洁度Clearance 空环,余隙Clinched Lead Terminal 紧箝式引脚Clinched-wire Through Connection 通孔弯线连接法Clip Terminal 绕线端接Clock Frequency(Clock Speed Clock Rate) 频率速率Coat, Coating 皮膜,表层Coaxial Cable 同轴缆线Coefficient of Thermal Expansion 热膨胀系数Co-firing 共烧Cold Flow 冷流Cold Solder Joint 冷焊点Collapse 塌扁Collect 夹头,夹筒Collimated Light 平行光Colloid 胶体Columnar Structure 柱状组织Comb Pattern 梳型电路Commodity Board 商品板Comparative Tracking lndex 比较性漏电指数Complex lon错离子Component Density 零件密度Component Hole 零件孔Component Orientation 零件方向Component Side 组件面Composite Epoxy Material (CEM)环氧树脂复合板材Compositech 非纺织型玻织布Composites(CEM-1,CEM-3) 复合板材Condensation Soldering 凝热焊接,液化放热焊接Conditioning 整孔Conductance 导电Conductive Adhesive 导电胶Conductive Anodic Filament 玻织纱式漏电Conductive Paste 导电膏Conductive Salt 导电盐Conductivity 导电度Conductor Spacing 导体间距Conformal Coating 贴护层,护形Conformal Mask 铜窗Conformity 吻合性,服贴性Connector 连接器Contact Angle 接触角Contact Area接触区Contact Resistance 接触电阻Continuity 连通性Continuous Lamination 连续压合,连续层压Contract Electronic Manufacturer (CEM or CM) 电子品合同式制造商Contract Service 协力商,分包商,外包厂Controlled Colaspse 定高坍塌Controlled Depth Drilling 定深钻孔Conversion Coating 转化皮膜Coplanarity 共面性Copolymer 共聚物Copper Foil 铜箔,铜皮Copper-invar-Copper(ClC) 综合夹心板Copper Mirror Test 铜镜试验Copper Paste 铜膏Core(Board) 核心板,核板Core Material 内层板材,核材Corner Crack通孔断角Corner Mark 板角标记Counterboring 垂直向下扩孔,埋头孔Counterflow (槽液)上下翻流,上下回流Countersinking 锥型扩孔,喇叭孔Coupling Agent 耦合剂Coupon, Test Coupon 板边试样Coverlayer, Coverlay 表护层Crack 裂痕Crater 弹坑,凹坑Crazing 白斑Crease 皱褶Creep 潜变Crossection Area 截面积Crosshatching 十字交叉区Crosshatch Testing 十字割痕试验Crosslinking, Crosslinkage 交联,回桥Crossover 越交,搭交Crosstalk 噪声,串讯Crush zone 磨碎区Crystalline Melting Point 晶体熔点Cure 硬化,熟化Current-Carrying Capability 载流能力Current Density 电流密度Curtain Coating 濂涂法Cycle Mode逐次打击式D-glass D玻璃Daisy Chained Design, Daisy Chaining 菊瓣设计, 菊花瓣连垫Datum Reference 基准参考点Daughter Board 子板Debris 碎屑,残材Deburring 去毛头Decibel(Db) 分贝Declination Angle 斜射角Definition 边缘齐直度,边缘逼真度Degradation 劣化Degrasing 脱脂Deionized Water 去离子水Delamination 分层Delay Line(Serpentine Line) 延迟线路(蛇形线路)Dendritic Growth 枝状生长Denier 丹尼尔Densitomer 透光度计Dent 凹陷Depanelization 切开,分开Deposition 沉积,附积,皮膜处理Desiccator 干燥器Desmearing 除胶渣Desoldering 解焊Developer 显像液,显像机Developing 显像Deviation 偏差Device 电子组件Demetting 缩锡Diazo Film 偶氮棕片Dichromate 重铬酸盐Dicing 芯片分割Dicyandiamide(Dicy) 双氰胺Die 冲模,铸模Die Attach 晶粒安装Die Bonding 晶粒接着Die Stamping 冲压Dielectric 介质Dielectric Breakdown 介质崩溃Dielectric Breakdown Voltage 介质崩溃电压Dielectric Constant 介质常数Dielectric Strength 介质强度Differential Scanning Calorimetry(DSC) 微差扫瞄熟卡分析法Diffusion Layer 扩散层Digitizing 数字化Dihedral Angle 双反斜角Dimensional Stability 尺度安定性,尺寸安定性Dimensional Stable Anode(DSA) 尺度稳定之阳极Dimple 酒窝,微凹Diode 二极管DlP(Dual lnline Package) 双排脚封装体Dip Coating 浸涂法Dip Soldering 浸焊法Dipole 偶极,双极Direct Clip Attach(DCA) 芯片直接安装在电路板Direct Emulsion 直接乳胶Direct/ lndirect Stencil 直间版膜Direct Plating 直接电镀,直接镀板Discrete Component 散装零件Discrete Wiring Board 散线电路板,复线板Dish Down 碟型下陷Dispensing 逐点分配,定点分配,定量分配Dispersant 分散剂Disspation Factor 散失因素Disturbed Joint 受扰焊点Doctor Blade 修平刀,刮平刀Dog Bone Design 哑铃式(原文狗骨式)互连设计Dog Ear 狗耳Doping 掺杂Double Access 双面露出Double Density 双倍密度Double Layer 电双层Double Treated Foil 双面处理铜箔Drag ln/Drag Out 带进/带出Drag Soldering 拖焊Drawbridging 吊桥效应Drift 漂移Drill Facet 钻尖切削面Drill Pointer 钻针重磨机Drilled Blank 已钻孔的裸板Dross 浮渣Drum Side铜箔光面,光胴面Dry Film干膜Dual Wave Soldering双波焊接Ductility 展性Dummy, Dummying 假镀片(板),假镀Dummy Land 假垫Durometer 橡胶硬度计DYCO strate电浆蚀孔增层法Dynamic Flex (FPC) 动态软板Dynamic Flexible Printed Board 动态软板 Dynamic Mechanical Analysis (DMA) 动态热机分析法E-Beam(Electron Beam) 电子束E-glass 电子级玻璃Eddy Current 涡电流Edge-Board Connector 板边(金手指)承接器Edge-Board contact 板边金手指Edge Clip 板边插针Edge-Dip Solderability Test 板面焊锡性测试Edge Spacing 板边空地,边宽EDTA 乙二胺四醋酸Eductor (液中)强流器,增流器Effluent 排放物Elastomer 弹性体Electric Strength (耐)电性强度Electro-deposited Photoresist 电着光阻,电泳光阻Electrodeposition 电镀Electroforming 电铸Electroless Deposition 无电镀,化学镀Electroless Nickel/lmmersion Gold(EN/LG)化镍浸金Electrolytic Cleaning 电解清洗Electrolytic Tough Pitch 电解铜Electro-migration 电迁移Electronic Package Hierarchy 电子构装层极Electro-phoresis 电泳动,电渗,电子构装Electro-static Damage 静电伤害Electro-tinning 镀锡Electro-winning 电解治炼Elongation 延伸性,延伸率Embossing 凸出性压花EMF 电动势EMI 电磁干扰Emulsion 乳化Emulsion Side 药膜面Encapsulating 囊封,胶囊Encapsulation 封胶,封包Encroachment 沾污,侵犯End Cap 封头Entek 有机保焊处理Entrapment 夹杂物Entry Material 盖板Epoxy Resin 环氧树脂Etchant 蚀刻剂,蚀刻液Etchback 回蚀Etch Factor 蚀刻因子,蚀刻函数Etching Indicator 蚀刻指标Etching Resist 抗蚀阻剂Eutetic Composition 共融组成Excimer Laser 准分子雷射Exotherm 放热(曲线)Expanded PTFE 扩张型”聚四氟乙烯”补强材简写为ePTFEExposure 曝光Eyelet 铆眼Fabric 网布Face Bonding 晶面朝下之结合Failure 故障,损坏Failure Analysis 故障分析Fan Out Wiring/Fan In Wiring扇出布线/扇入布线Farad 法拉Faraday 法拉第Fatigue Strength 抗疲劳强度Fault 缺陷,瑕疵Fault Plane 断层面Feasibility Analysis 可行性分析Features 成员,诸元Feed Through Hole 导通孔Feeder 进料器,送料器Fiber Exposure 玻纤显露Fiducial Mark 基准记号,光学靶标Filament 纤丝,单丝Fill 纬向Filler 填充料Fillet 内圆填角,填锡Film 底片Film Adhesive 接着膜,黏合膜Filter 过滤器,滤光镜片,滤波器Final Finishing 外表处理,终面处理Fine Line 细线Fineness 纯度,成色,粒度Fine Pitch 密脚距,密线距,密垫距Finger 手指(板边连续排列接点)Finishing 终饰,终修Finite Element Method 有限要素分析法First Article首产品First Pass-Yield 初检良品率Fish Bone Chant 鱼骨图Fixture 夹具Flair 第一面外缘变形,刃角变形Flag 芯片安置区Flame Point 自燃点Flammability 燃性Flame Resistant 耐燃性Flammability Rate 燃性等级Flare 扇形崩口Flash Plating 闪镀Flashover 闪络Flat Coat 全平涂布,板面平铺Flat Plug 平塞,平填Flat Cable 扁平排线Flat Pack 扁平封装(之零件)Flatness 平坦度Flexible Printed Circuit ,FPC 软板Flexural Failure 挠曲故障Flexural Module 弯曲模数,抗挠性模数Flexural Strength 抗挠强度Flexural Strength at Elevalted Temperature 高渐中抗挠强度Flip Chip 覆晶,扣晶Flip Chip Packaging 覆晶封装法(或组装法)Floating Shielding 浮起式挡架Flocculation 絮凝,凝聚Flood Stroke Print 覆墨冲程印刷Flow Soldering 流焊Fluorescence 荧光Flurocarbon Resin 碳氟树脂Flush Board 表面全平板Flush Conductor 嵌入式线路,贴平式导体Flush Point 闪火点Flute 退屑槽Flux 助焊剂Flying Lead 飞脚Foil Burr 铜箔毛边Foil Lamination 铜箔压板法Foot 残足Foot Print(Land Pattern) 脚垫Foreign Material 外来物,异物Form-to-List 布线说明清单Four Point Twisting四点扭曲法Freeboard 干舷Free Radical 自由基,自由根Frequency 频率Frit 玻璃熔料Fully-additive Process 全加成法Fungus Resistance 抗霉性Fused Coating 熔锡层Fusing 熔合Fusing Fluid 助熔液Gage, Gauge量规Gallium Arsenide(GaAs) 砷化镓Galvanic Corrosion 贾凡尼式腐蚀Galvanic Series 贾凡尼次序Galvanizing 镀锌Galvanometer Mirror 电流计式反射镜GAP 第一面分离,长刃断开Gas Knife Cooling 氯刀冷却法Gate Array 阐极数组,阐列Gel Time 胶性时间Gelation Particle 胶凝点Gerber Date, Gerber File格博档案GETEK 奇异公司板材Ghost image 阴影Gilding 镀金Glass Fiber 玻纤Glass Fiber Protrusion/Gouging, Groove 玻纤突出/挖破Glass Transition Temperature , Tg 玻璃态转化温度Glaze 釉面,釉料Glob Top 圆顶封装体Globule Test 球状测试法Glycol(Ethylene Glycol) 乙二醇Golden Board 测试用标准板Grain Size 结晶粒度Graphite 石墨Grid 标准格Ground Plane(or Earth Plane) 接地层Ground Plane Clearance 接地空环Gull Wing Lead 鸥翼引脚Grid Spacing(Distance) 格距,孔距Gross Leak 大漏Guide Pin导针GP (Global Warming Potentials) 地球温室潜因Galf Angle 半角Halide 卤化物Haloing 白圈,白边Halon 海龙Halation 环晕Hard Anodizing 硬阳极化Hard Chrome Plating 镀硬铬Hard Soldering 硬焊Hardener 硬化剂Hardness 硬度Haring-Blum Cell 海因槽Harness 电缆组合Hay Wire 跳线Heat Cleaning 烧洁Heat Dissipation 散热Heat Distortion Point (Temp.) 热变形点(温度)Heat Sealing 热封Heat Sink 散热器Heat Sink Plane 散热层Heatsink Tool 散热工具Heat Transfer Paste 导热膏,传热膏Hertz(tz) 赫High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hi-Rel 高可靠度Hipot Test 高压电测Hit 击Holding Time 停置时间Hole Breakout 孔位破出Hole Counter 数孔机Hole Density 孔数密度Hole Location 孔位Hole Preparation 通孔准备Hole Pull Strength 孔壁抗拉强度Hole Void 破洞Hook 切削刃缘外凸Hot Air Solder Levelling (HASL) 喷锡Hot Bar (Reflow) Soldering 热把焊接Hot Gas Soldering 热风手焊Hot Roll Lamination 热转轴压贴法THE (High Temperature Elongation) 高温延伸性(率)Hull Cell 哈氏槽Hybrid integrated Circuit 混成电路Hydraulic Bulge Test 液压鼓起试验Hydrogen 氢气Hydrogen Embrittlement 气脆Hydrogen Overvoltage 氢超电压,氢过电压Hydrolic Pressure 液压,油压Hydrolysis 水解Hydrophilic 亲水性Hygroscopic 吸湿性Hypersorption 超吸附I. C. Socket 集成电路器插座icicle 锡尖Illuminance 照度Image Transfer 影像转移,图像转移Imaging 成像处理Immersion Plating 浸镀Immersion Silver 浸镀银Immersion Tin浸镀锡Impedance 阻抗Impedance Match 阻抗匹配Impinge 冲打Impregnate 含浸In-circuit Testing 组装板电测Inclusion 异物,夹杂物Interconnection Defect (ICD) 孔壁与孔环互连处之缺失Indexing Hole 基准孔,参考孔Inductance (L) 电感In-feed Rate(Down-feed Rate) 进刀速率Information Appliance(IA) 信息家电Infrared (IR) 红外线Input/Output 输入/输出Insert, Insertion 插接,插装Inspection Overlay 重合套检底片Insulation Resistance 绝缘电阻Integrated Circuit (IC) 集成电路器Interconnection 互连Interface 界面Intermatallic Compound(IMC) 界面合金共化物Internal Stress 内应力Interposer 互连导电物,互连体Interstitial Via Hole (IVH)/Inner Hole 局部层间导通孔,内通孔Invar 殷钢Ion Cleanliness 离子清洁度Ion Exchange Resins 离子交换树脂Ion Migration 离子迁移Ionizable (Ionic) Contaimination 离子性污染Ionization 游离,电离Ionization Voltage (Corona Level) 电离化电压(电晕水平)IPC 美国印刷电路板协会Isolation 隔离性,隔绝性Isotropic Conductive Adhesive 均向导电胶J-Lead J型接脚,弯钩型接脚JEDEC 联合电子组件工程委员会Job Shop 专业工厂,职业工厂Joule 焦耳Jump Wire 跳线Junction 接(合)面,接头Just-In-Time (JIT) 适时供应,及时出现Kapton 聚亚酰胺软材Karat 克拉,开Kauri-Butanol Value考立丁醇值(简称K.B值)Kerf 切形,裁截Kevlar 聚酰胺纤维Key 电键Key Board 键盘,键盘板Kiss Pressure 吻压,低压Knoop Hardness 努普硬度Known Good Die (KGD) 已知之良好芯片Kovar 科伐合金Kraft Paper 牛皮纸Lamda Wave 延伸平波Laminar Flow 平流Laminar Structure 片状结构Laminate Void 板材空洞Lamination Void 压合空洞Laminate(s) 基板/积层板Laminator 压膜机Land 孔环焊垫,表面(方型)焊垫Land Grid Array (LGA) 承垫(焊垫)格列封装法Landless Hole 无环通孔Large Window 开大窗Laser 雷射,激光Laser Ablation 雷射烧蚀,雷射成孔Laser Ablation Thresholds 烧蚀起限Laser Absorption (Absortance) 雷射吸收度Laser Beam Divergence雷射散射光束Laser Conformal Mask 铜窗Laser Direct Imaging (LDI) 雷