深圳临辉PCB简介.pptx

公公司司 简简 介介1.GeneralInformation(概括资料概括资料)2.CompanyMission（公司方针）（公司方针）3.OrganizationChart（组织架构图）（组织架构图）4.ProductClassification（产品类别）（产品类别）5.ManufacturingProcessingChart（工艺流程图）（工艺流程图）6.EquipmentList（设备清单）（设备清单）7.Capability/Capacity（生产能力）（生产能力）8.TechnicalSpecification（技术标准）（技术标准）9.Quality&WorkingStandards（质量标准）（质量标准）10.Certification（体系认证）（体系认证）11.CustomerList（现有客户）（现有客户）12.FutureDevelopment（发展展望）（发展展望）1.概括资料概括资料地址：深圳市宝安区翻身路鸿都商务大厦地址：深圳市宝安区翻身路鸿都商务大厦2 2楼楼 电话电话：[phone]传真传真：[phone] E-mail： 投资额投资额：1.5亿港币 成立日期成立日期：2005年12月 厂区面积厂区面积:占地面积：40000平方米 建筑面积：20000平方米 工厂地理位置工厂地理位置2.公司方针公司方针Fulfillcustomersexpectationandrequirementwithrespecttoquality,cost,serviceandon-timedelivery,全面满足客户对质量，成本，服务和交货的要求全面满足客户对质量，成本，服务和交货的要求Establishalongtermbusinessrelationshipwithcustomers.与客户建立长期合作的伙伴关系与客户建立长期合作的伙伴关系Dedicatedtocontinuousimprovementsinefficiency,quality，technologyandservices.专注于持续提高效率，质量，技术及服务水平专注于持续提高效率，质量，技术及服务水平 总经理 General Manager 副总经理Vice General Manager财务部FinancialDept 副总经理Vice General Manager 总工程师 Chief Engineer 副总经理Vice General Manager市场部MarketingDept物料部P M C生产计划部P P C维修部Maintenance Dept人事部PersonnelDept文控部DocumentDept工艺技术部Technical Dept总经办Executive生产部ProductionDept采购部PurchaseDept工程部EngineeringDept品质部Q A Dept4.产品类别产品类别5.1.多层板工艺流程图多层板工艺流程图参照双面板流程（参照双面板流程（5.2）下 料钻定位孔内层图形转移QC检查蚀 刻内层电测黑氧化叠 层层 压磨 边钻定位孔数 控 钻去 粘 污QC检查QC检查5.2.双面板流程图双面板流程图下 料数控钻QC检查电 镀图 形 印 刷图形电镀整 板 镀感光油图形转移闪 镀 金去锡印绿油字符镀 纯 锡蚀 刻最后清洗镀金手指喷锡QC检查E/TQAQC检查QC检查QC检查QC检查QC检查外型加工成 品 库干膜图形转移QC检查OR 6.生产设备清单生产设备清单EquipmentName（设备名称）（设备名称）QTY（数量）（数量）ModelNo.Manufactures（厂商）（厂商）1.CNC Drilling Machine(8-heads)（8头钻机）10GIGAPluritec(Italy)2.CNC Routing Machine（铣床）4TL-RU4BATien Lang3.CNC Drilling Machine(Aual heads)（4头钻机）3TDM-02Timax4.CNC V-Cutting Maching（数控V刻机）2SCHMOLLMASHINENSCHMOLL5.Air Compressor （空压机）1ATLAS COPCO GA37ATLAS COPCO6.Waste Treament （水处理机）17.Bevel Mate （斜边机）1Bevelmate035Radoll8.Vacuum Presser (3500Tons)2Tien Tin(Taiwan)9.Prepeg Cutting Machine （半固化片下料机）1PC-016.生产设备清单生产设备清单EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）10.Copper Foil Cutting Machine铜箔下料机1CC-0111.Target Drilling 钻定位孔机1VSF-812.CCD Automatic Target DrillingCCD 自动钻定位孔机1CHID-6813.Pressing Conveyor Line 传送机114.Temperature Control Oven for Inner Layer 内层烘箱1DRY-61015.Brown Oxide Line 棕化线1MB30NL03001Universal16.Stainless Steel Pressing Board Scrubber磨钢板机1SCS22AP03001Universal17.Deburring Machine打磨机1FL400SB03001Universal18.Automatic PTH Line with Desmear化学沉铜线16.生产设备清单生产设备清单EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）19.Automatic Panel Copper Plating Line 自动整板镀铜线120.Automatic Pattern Copper&Tin Plating Line 自动图形镀铜/锡线121.Automatic Copper,Nickel&Gold Plating Line 自动镀铜，镍，金线122.Automatic Flash Gold Plating Line 自动闪镀金线123.Dry Film Pretreatment line干膜预处理线1SCA22N0300224.Dry Film Laminator贴膜机1Dynachem30025.Dry Film Laminator贴膜机1Dupont Riston26.Image Exposure Machine曝光机2ORC-HMW-680-GM27.Image Exposure Machine曝光机2ORC-HMW201B-5K6.生产设备清单生产设备清单EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）28.Dry Film Developer干膜显影机1HL-DEVELUniversal PCB Equipment CO.,LTD29.Dry Film Developer干膜显影机1DLD20N03001Universal PCB Equipment CO.,LTD30.Dry Film Scrubber干膜磨板机1HL-SC2/2D3Universal PCB Equipment CO.,LTD31.Direct Plating Line(DMSE)直接电镀线1HL-D3472Universal PCB Equipment CO.,LTD32.Immersion Gold Plating Line化学沉金线1Sam Wo PCB Equipment CO.,LTD33.Gold Finger Tab Plating Line金手指镀金线1Universal PCB Equipment CO.,LTD34.Pneumatic Screen Printer气动丝印机2PA3-F6635.Automatic Cut Sheet Laminator including Loader and Unloader自动开料机1CSL-A25T,CN-660,NT-0341B,0223A36.Pneumatic Screen Printer气动丝印机10LD-6580-PSR6.生产设备清单生产设备清单EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）37.Fully Automatic Double side Photoresist Coater 全自动涂覆机138.UV Curing Machine 紫外线固化机1UVC-502+752D39.LPISM Exposure Machine 感光油墨曝光机1M-7209(8K)C SUN40.LPISM Pretreatment Line感光油墨预处理机1SCA44N03001Universal PCB Equipment CO.,LTD41.LPISM Developer 感光油墨显影机1TEL1000A03003Dlw20N03001(R1)Universal PCB Equipment CO.,LTD42.LPISM Developer感光油墨显影机1HL-DEVELUniversal PCB Equipment CO.,LTD43.4 Chambers Pre-bake Tunneling Oven 隧道式预烘烘箱1T4L03001Universal PCB Equipment CO.,LTD44.8 Chambers Post-bake Tunneling Oven 隧道式后烘烘箱1T8H03001Universal PCB Equipment CO.,LTD45.HAL Pre-treatment Line 喷锡前处理线1SP15n03001(R1)Universal PCB Equipment CO.,LTD6.生产设备清单生产设备清单 EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）46.HAL Post-treatment Line喷锡后处理线1SB11N03001(R1)Universal PCB Equipment CO.,LTD47.Dual Door Oven双门烘箱5Universal PCB Equipment CO.,LTD48Electroless Copper Pre-treatment Line with auto-dosing Controller 带自动添加系统的化学沉铜前处理线1DF20NL03001TME1000A03001Universal PCB Equipment CO.,LTD49.Dry Film Stripper and Acid Etching Line with auto-dosing Controller 带自动添加系统的干膜脱膜及酸性蚀刻线1EDS33NL03001TDL1000A02009TET1200A(R1)TSF1000A02002Universal PCB Equipment CO.,LTD50.Dry Film Stripper and Etching Line with auto-dosing Controller 带自动添加系统的干膜脱膜及蚀刻线1SFE18N03001TET1000a02004Universal PCB Equipment CO.,LTD51.Dry film Stripper,Etching and Tin Stripper with auto-dosing Controller带自动添加系 统的干膜脱膜，蚀刻及去锡线1SFE18N03001TST1000A03004TST400A02001Universal PCB Equipment CO.,LTD6.生产设备清单生产设备清单EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）52.Hot Air Leveling Machine 喷锡线1HAL-2424DShangsui(Taiwan)53.Entek Line 有机涂覆线1EK10NL03001Universal PCB Equipment CO.,LTD54.Final Cleaning Line 最终清洗线1CL11NT03001Universal PCB Equipment CO.,LTD55.Vacuum Packing Machine真空包装机1SP-5580DQualipac56.Punching Machine(60T)冲压机（60吨）3J23-60A57.Punching Machine(40T)冲压机（40吨）10J23-40A58.Punching Machine(25T)冲压机（25吨）10J23-25A6.生产准备设备清单生产准备设备清单EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）59.Laser Plotter 光绘机1Firetools J0500Symbolic Sciences Firetools60.Artwork Develop底片显影机1FG-720XFujinfilm61.Stencil Expose Machine底版曝光机1W-SP-4860A62.Horizontal Stencil Oven水平式烘箱1EA11307ATMA63.Automatic Emulsion Printer 自动感光液丝印机1EA-1012CATMA64.Squeege Sharpener 削刀1EA-100ATMA65.Mechanical Stencil Stretcher 延伸器1EA-1215ATMA6.质量检查设备清单质量检查设备清单EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）66.Flying Probe E-Tester 飞针测试仪1A2ATG(W.Germany)67.High Voltage E-Tester 高压电测仪22MV300Mason68.Fischerscope(X-ray Measurement)X射线测试仪1XDLM-ZFischer Instrumention69.V-Cut Scoring Depth CheckerV刻深度检测仪1VT210SHODA TECHTRON70.Micro-section Kit 微切片机1METABER V200071.Binocular Metallic Microscope金相显微镜128371MEIJI72.UV Light Spectrometer紫外光分光计1UV755B73.Tension Meter 张力测试仪1KEC-AE74.PCB Digital Peel Strength Tension Meter 剥离强度测试仪16.质量检查设备清单质量检查设备清单EquipmentName（设备名称）（设备名称）QTYModelNo.Manufactures（厂商）（厂商）75.Gel Time Tester 凝胶时间测试仪1VGT-2276.Optical Inspection System(AOI)光学检测仪1PI 8000Dainippon Screen MFG CO.,LTD77.Defect Verification&Repair System 缺陷确认及修复系统1VT-1500Dainippon Screen MFG CO.,LTD7.生产能力生产能力 7.1产品产品：2层至16层印制电路板 7.2表面处理表面处理：喷锡 镀金（130微英寸）化学沉金 镀金手指 有机帘布涂覆 7.3生产能力生产能力：50000平方米/月（以四层板为基础计算）7.4市场比例市场比例：海外：60%本地：40%7.5生产周期生产周期DoubleSide（双面板双面板）Multilayer（多层板）（多层板）Sample（样品）（样品）5days6daysNewOrder（新订单）（新订单）7 days10daysRepeatOrder（重复订单（重复订单）6 days8 days8.技术标准技术标准 技技术术标标准准备备注注Number of Layer层数216(HDI 412层）Material材料CEM-3,FR-4,BT ResinFinish Board Thickness板厚0.2mm3.20mm (8mil126mil)Minimum Copper Thickness最小铜厚0.1mm(4mil)Copper Thickness铜厚 oz min;3 oz max.Min.Trace Width&Line Spacing最小线宽/间距0.075mm(3mil)Min.Hole Diameter for CNC Drilling最小钻孔孔径0.1mm(4mil)Min.Hole Diameter for Punching最小冲孔孔径0.2mm(8mil)8.技术标准技术标准技技术术标标准准备备注注Dimension Tolerance尺寸公差Hole Position孔位+/-0.075mm(3mil)CNC DrillingConductor 线宽Witdth(W)+/-0.075mm(3mil)or+/-20%of original artworkHole Diameter(H)孔径PTH+/-0.075mm(3mil)Non-PTH+/-0.05mm(2mil)Outline imension外型公差+/-0.15mm(6mil)by CNC Routing+/-0.10mm(4mil)by PunchingWarp&Twist翘曲度+/-0.075mm(3mil)Surface Treatment on Land Area焊盘表面处理Nichel/Gold Plating/Entek/Hot Air LevelingInsulation Resistance绝缘电阻10Kohm20MohmConductivity传导电阻=2W公差PTH L:+/-0.15mm(6mil)W:+/-0.1mm(4mil)Where:L=Slot length W=Slot width Min.drill bit size for multi-drill is 0.7mmNPTH L:+/-0.125mm(6mil)W:+/-0.1mm(4mil)8.技术标准技术标准Minimum spacing between hole edge to circuitry pattern最小孔到图形距离NPTH Hole:0.13mm(5mil)PTH Hole:0.18mm(7mil)Registration Tolerance of front/Back imageFront image vs back image图形偏差0.075mm(3mil)Multylayers多层板Layer-layer misregistration层间偏差4 layers:015mm(6mil)max.6 layers:025mm(10mil)max.Min.spacing between hole edge to circuitry pattern of an inner layer最小孔到内层图形距离0.25mm(10mil)Min.spacing between board outline to circuitry pattern of an inner layer最小板边到内层图形距离0.25mm(10mil)Board thickness tolerance板厚公差4 layers:+/-0.13mm(5mil)6 layers:+/-0.15mm(6mil)Impedence Control特性阻抗60 ohm+/-10%9.质量标准质量标准 IPCStandards&PublicationsIPC标准标准(IPC-A-600FClassII,IPC-6012)UnderwriterLaboratory(UL-94V0,UL-769)UL标准标准InternalSpecification内部控制标准内部控制标准10.Certification证书证书UL TS16949 ISO14001ROHS11.主要客户清单主要客户清单CREATIVESHARPPDIBOSHCANON瑞美瑞美MOTOROLABANDAI康大基业康大基业D-LINKHPC天彦通信天彦通信GVCRADICA宇顺通宇顺通12.未来发展未来发展*HDIprojectHDI项目项目.Buy10laserdrillmachinein20102010年购买年购买10台激光钻机台激光钻机.Make14layerHDIsamplesinthemiddleof102010年中制作年中制作14层层HDI样品样品.Massproductionattheendof20052005年底量产年底量产*ImmersionSilver/Tin沉银沉银/锡锡项目项目.EstablishtheimmersionSilver/Tinprojectintheendof2006,adaptforthetrendofnoLeadless.2006年底建成沉银年底建成沉银/锡项目，以适应无铅化趋势锡项目，以适应无铅化趋势*Boththetechnologyandqualitycanbehighlyupgraded.技术与质量均将大幅度提高技术与质量均将大幅度提高