IBIS模型语法.doc

Appendix A:
IBIS Model Syntax
6/2/24
Roy Leventhal

Reference IBIS 3.2

Contents

Table 1: General Rules 9
Format 9
File Names 9
Reserved Words 9
POWER 9
GND 9
NC 9
NA 9
Line Length 9
Comments 9
Keywords 9
Allowed Scaling Factor Prefixes 9
Tab characters 9
Temperature 9
Currents 9
Table 2: General Properties 10
[IBIS Ver] 10
[Comment Char] 10
[File Name] 10
[File Rev] 10
[Date] 10
[Source] 10
[Notes] 10
[Copyright] 10
[Disclaimer] 10
Table 3: Component Properties 12
[Component] 12
Si_location 12
Timing_location 12
[Manufacturer] 12
[Voltage Range] 12
[Temperature Range] 12
[END] 12
Table 4: Package and Pin Properties 13
[Package] 13
R_pkg 13
L_pkg 13
C_pkg 13
[Pin] 13
signal_name 13
model_name 13
R_pin 13
L_pin 13
C_pin 13
[Package Model] 15
[Define Package Model] 15
[Manufacturer] 19
[OEM] 19
[Description] 19
[Number of Pins] 19
[Pin Numbers] 19
Len 19
L, R, C. 19
Fork 19
Endfork 19
[Number Of Sections] 22
[Model Data] 22
[Resistance Matrix] 23
[Inductance Matrix] 23
Banded_matrix 23
Sparse_matrix 23
Full_matrix 23
[Capacitance Matrix] 27
[Row] 27
[Bandwidth] 27
[End Model Data] 27
[Pin Mapping] 28
pulldown_ref: 28
pullup_ref: 28
gnd_clamp_ref: 28
power_clamp_ref: 28
[Rac] 30
[Cac] 30
[Rgnd] 30
[Rpower] 30
[Diff Pin] 30
inv_pin: 30
vdiff: 30
tdelay_typ: 30
tdelay_min: 30
Tdelay_max: 30
[Series Pin Mapping] 33
pin_2: 33
model_name: 33
funtion_table_group: 33
[Series Switch Groups] 33
On, Off 33
[End Package Model] 33
Table 5: V-I Behavioral Properties 36
[Model] 36
Model_type 36
C_comp: Note 1*. 36
Polarity 36
Enable 36
Vinl 36
Vinh 36
[On] 39
[Off] 39
[R Series] 39
[L Series] 39
[C Series] 39
[Rl Series] 39
[Rc Series] 39
[Lc Series] 39
[Series Current] 39
[Series MOSFET] 39
Vds 39
Vol, Voh 44
Technology 44
[Pulldown] 44
[Pullup] 44
[GND Clamp] 44
[POWER Clamp] 44
[Pullup Reference] 48
[Pulldown Reference] 48
[GND Clamp Reference] 48
[POWER Clamp Reference] 48
[Model Selector] 49
[Model Spec] 51
Vinh 51
Vinh+ 51
Vinh- 51
Vinl+ 51
Vinl- 51
S_overshoot_high 51
S_overshoot_low 51
D_overshoot_high 51
D_overshoot_low 51
D_overshoot_time 51
Pulse_high 51
Pulse_low 51
Pulse_time 51
Vmeas 51
[Add Submodel] 54
submodel_name 54
mode 54
[Submodel] 54
Submodel_type 54
[Submodel Spec] 54
V_trigger_r 54
V_trigger_f 54
Off_delay 54
[GND Pulse Table] 59
[POWER Pulse Table] 59
[TTgnd] 59
[TTpower] 59
Table 6: V-T Behavioral Properties 63
[Ramp] 63
dV/dt_r 63
dV/dt_f 63
R_load 63
Vmeas 63
Cref 63
Rref 63
Vref 63
[Rising Waveform] & 63
[Falling Waveform] 63
R_fixture 63
C_fixture 63
L_fixture 63
V_fixture 63
V_fixture_min 63
V_fixture_max 63
R_dut 63
C_dut 63
L_dut 63
[Driver Schedule] 67
Rise_on_dly 67
Rise_off_dly 67
Fall_on_dly 67
Fall_off_dly 67
Table 7: Board Properties 69
[Begin Board Description] 69
[Manufacturer] 69
[Number of Pins] 69
[Pin List] 70
[Path Description] 70
Len 70
L, R, C 70
Fork 70
Endfork 70
Pin 70
Node 70
[Reference Designator Map] 75
[End Board Description] 75
[End] 75
[END] 75

Acknowledgement:

The text of the IBIS specification, v3.2, was used verbatim extensively to create this document.

Purpose:

This document was created to separate out syntax rules, file formatting and examples and make those subjects more accessible to the user. This author has added not much commentary. But, the material of the IBIS spec has been reorganized and reformatted. The IBIS spec is organized around a set of [Keywords] and (in some cases) their subparameters.

I have reorganized those keywords into a set of 7 tables as follows:

· Table 1: General Rules - reserved words, ASCII characters, etc.

· Table 2: General Properties - "boilerplate."

· Table 3: Component Properties - supplier, voltage and temperature ranges.

· Table 4: Package and Pin Properties - connections and parasitics.

· Table 5: V-I Behavioral Properties - driver voltage-current capabilities, clamping,
power bussing, model types, etc.

· Table 6: V-T Behavioral Properties - slew rates and switching speeds.

· Table 7: Electrical Board Description - abstracting a board as a component.

Most of the above tables are split apart into sections or subtables so as to bring technical notes and examples into close association with the listed keywords and examples.

An industry committee created the IBIS specification over a period of years. It is still a "work in progress" undergoing continuing modification. As this author sees it, the specification is in need of organization and a roadmap to its information since disparate elements are mixed together and separated into unrelated sections and specific information is not easily accessible.

This syntax guide is offered in the hope that it will aid the reader in understanding the IBIS specification. This guide is followed by an example of an IBIS model file used with the permission of TI semiconductor.

Table 1: General Rules
Keyword
Syntax
Rules
Notes
Format
ASCII, case sensitive except for reserved words and keywords. No special non-DOS characters allowed.
ASCII as defined in ANSI Standard X3.4-1986

File Names
All lower case, ending in .ibs extension for model files, .pkg extension for separate package model files, and .ebd for electrical board description files. 8 characters max plus extension

Reserved Words
POWER
Used with power supply pins

GND
Used with ground pins
NC
No-connect pins
NA
Used where data not available
Line Length
80 characters max

Comments
Default are lines that begin with “|” (pipe)

Keywords
Must be enclosed with square brackets [ ] and begin in column 1
Underscores and spaces are equivalent in keywords. Spaces not allowed in subparameter names.

Allowed Scaling Factor Prefixes
T
Tera
Parser assumes volts, amperes, ohms, farads, henries & seconds if not specified
G
Giga
M
Mega
k
Kilo
m
Milli
u
Micro
n
Nano
p
Pico
f
Femto
1.234e-12
scientific notation
Tab characters
Allowed. But, to be avoided

Temperature
Degrees Celsius

Currents
Positive when their direction is into the component

Table 2: General Properties
Keyword
Syntax
Rules
Notes
[IBIS Ver]
Informs parser of the IBIS template version
Must be first keyword. Can be preceded by comment lines
Example #1
[Comment Char]
The new character to be defined must be followed by the underscore character and the letters "char". Ex.: "|_char" redundantly redefines the comment character to be the pipe character. The new comment character is in effect only following the [Comment Char] keyword.
Following characters MAY NOT be used: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z a b c d e f g h i j k l m n o p q r s t u v w x y z 0 1 2 3 4 5 6 7 8 9 [ ] . _ / = + -

[File Name]
All lower case, ending in .ibs extension for model files, .pkg extension for separate package model files, and .ebd for electrical board description files. 8 characters max plus extension
The file name must be the actual name of the file
Example #2
[File Rev]

Revision level is set at the discretion of the engineer defining the file. The following are recommended:
0.x silicon and file in development
1.x pre-silicon file data from silicon model only
2.x file correlated to silicon measurements
3.x mature product, no more changes likely
Example #3
[Date]
40 characters max
Latest file revision date
Example #4
[Source]
Originator of IBIS file
Optional
[Notes]
Paragraph allowed
[Copyright]
[Disclaimer]

#1 IBIS Ver

[IBIS Ver] 3.2 | Used for template variations
|

#2 File Name

[File Name] ver3_2.ibs
|

#3 File Rev

[File Rev] 1.0 | Used for .ibs file variations

#4 Date/Source/Notes/Disclaimer/Copyright

[Date] January 15, 1999 | The latest file revision date
|
[Source] Put originator and the source of information here. For
example:

From silicon level SPICE model at Intel.
From lab measurement at IEI.
Compiled from manufacturer's data book at Quad Design, etc.
|
[Notes] Use this section for special notes related to the file.
|
[Disclaimer] This information is for modeling purposes only and is
not guaranteed.
| May vary by component
|
[Copyright] Copyright 1999, XYZ Corp., All Rights Reserved
|

Table 3: Component Properties
Keyword
Syntax
Rules
Notes
[Component]
40 characters max. Blank characters allowed. NOTE: Blank characters not recommended due to usability issues.
In multiple device files each one must begin with its own Component keyword
Marks start of IBIS description. Example #5
Si_location
Must be 'Pin' or 'Die'
Example #5
Timing_location
Must be 'Pin' or 'Die'
Example #5
[Manufacturer]
40 characters max. Blank characters allowed

Example #6
[Voltage Range]
Note 1.
Provide actual voltages (not percentages) in the typ, min, max format. If the [Voltage Range] keyword is not present, then all four of these keywords described below must be present: [Pullup Reference], [Pulldown Reference], [POWER Clamp Reference], and [GND Clamp Reference]. If the [Voltage Range] is present, the other keywords are optional and may or may not be used as required. It is legal (although redundant) for an optional keyword to specify the same voltage as specified by the [Voltage Range] keyword.
Example #7
[Temperature Range]
Note 1.
List the actual die temperatures (not percentages) in the typ, min, max format. The [Temperature Range] keyword also describes the temperature range over which the various V/I curves and ramp rates were derived.
Example #8
[END]

Defines the end of the .ibs file.

#5 Component

[Component] 7403398 MC452
|
Si_location Pin | Optional subparameters to give measurement
Timing_location Die | location positions
|

#6 Manufacturer

[Manufacturer] Quality Semiconductors Ltd.
|

#7 Voltage Range

| variable typ min max
[Voltage Range] 5.0V 4.5V 5.5V
|

#8 Temperature Range

| variable typ min max
[Temperature Range] 27.0 -50 130.0

Table 4: Package and Pin Properties
Keyword
Syntax
Rules
Notes
[Package]
R_pkg
Note 1.*
Example #9
L_pkg
C_pkg
[Pin]
5 characters max
1st column
Note 2, Example #10
signal_name
2nd column, 20 characters max
model_name

3rd column, 20 characters max: associates I/O [Model] keyword or GND, POWER, or NC below it.
R_pin
Note 1.
L_pin
C_pin
(cont.)
Assumed: Consistent with IBIS syntax.

Note 1
Typical must be specified. If data for Min & Max columns is not available that must be noted with NA. Consists of 3 columns (typ-min-max) of 9 characters max each. On each line at least one space must separate each column entry from its neighbor.

#9 Package

[Package]
| variable typ min max
R_pkg 250.0m 225.0m 275.0m
L_pkg 15.0nH 12.0nH 18.0nH
C_pkg 18.0pF 15.0pF 20.0pF
|

Note 2
Each line must have either 3 or 6 columns. If six are used they are used to override the default package parameters. If NA is used the default package parameters are still used. At least one space must separate each column.

#10 Pin

[Pin] signal_name model_name R_pin L_pin C_pin
|
1 RAS0# Buffer1 200.0m 5.0nH 2.0pF
2 RAS1# Buffer2 209.0m NA 2.5pF
3 EN1# Input1 NA 6.3nH NA
4 A0 3-state
5 D0 I/O1
6 RD# Input2 310.0m 3.0nH 2.0pF
7 WR# Input2
8 A1 I/O2
9 D1 I/O2
10 GND GND 297.0m 6.7nH 3.4pF
11 RDY# Input2
12 GND GND 270.0m 5.3nH 4.0pF
| .
| .
| .
18 Vcc3 POWER
19 NC NC
20 Vcc5 POWER 226.0m NA 1.0pF
|

Table 4 (cont.): Package and Pin Properties
Keyword
Syntax
Rules
Notes
[Package Model]
40 characters max. Blank characters allowed. Inserted as keyword within Component keyword. The [Package Model] keyword is optional. If more than the default RLC package model is desired, use the [Define Package Model] keyword.
The simulator will search for a matching package model name as an
argument to a [Define Package Model] keyword in the current IBIS file first. If a match is not found, the simulator will look for a match in an external .pkg file. If the package model is in a separate .pkg file, it must be kept in the same directory as the .ibs file.
Note 10, Example #11
[Define Package Model]
40 characters max. Blank characters are allowed.
If the .pkg file has data for more than one package, each section must begin with a new [Define Package Model]. For every package model name defined under the [Package Model] keyword, there must be a matching [Define Package Model]
Example #12
(cont.)

Note 10
Use the [Package Model] keyword within a [Component] to indicate the package model for that part.

The specification permits .ibs files to contain the following additional list of package model keywords. Note that the actual package models can be in a separate <package_file_name>.pkg file or can exist in the IBIS files between the [Define Package Model]...[End Package Model] keywords for each package model that is defined. For reference, these keywords are listed below. Full descriptions follow:

[Define Package Model] Required if the [Package Model] keyword is used
[Manufacturer] (note a)
[OEM] (note a)
[Description] (note a)
[Number of Pins] (note a)
[Pin Numbers] (note a)
[Model Data] (note a)
[Resistance Matrix] Optional
[Inductance Matrix] (note a)
[Capacitance Matrix] (note a)
[Bandwidth] Required (for Banded_matrix matrices only)
[Row] (note a)
[End Model Data] (note a)
[End Package Model] (note a)

(note a) Required when the [Define Package Model] keyword is used

When package model definitions occur within a .ibs file, their scope is "local" -- they are known only within that .ibs file and no other. In addition, within that .ibs file, they override any globally defined package models that have the same name.

USAGE RULES FOR THE .PKG FILE

Package mo