PCBA检验规范.doc
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1、 PCBA检验规范编 号:版 本:V1.0生效日期:1修订情况表修订历史版本说明作者审核批准生效日期2术语表术语表名称说明PCBA检验规范目 录1.目的(PURPOSE)12.范围(SCOPE)1 3.名词解释(WORDS EXPLANATION)14.参考文件(REFERENCE DOCUMENT)15. 职责(RESPONSIBILITY) .16. 作业流程及内容(Flow chart and content).17. 修订权限(AUTHORITY OF MODIFICATION)28. 附件(ATTACHMENT).2 8.1 附件一(PCBA).4 8.2 附件二(机构类).42 8
2、.3 附件三(其它).52PCBA检验规范1 目的(Purpose) 建立产品外观目视检验标准, 使产品检验之判定有所依循, 同时藉由检验资料的回馈分析建立良好的workmanship,防止不良之发生. To establish the standard inspection of product cosmetic for operation to follow, and establish well workmanship by feedback and analyzing the inspection document to void failure.2 范围(Scope) 本规范适用于所
3、有产品(含半成品及成品PCBA)的外观目视检验, 包含自行生产制造之PCBA, 委托外包生产制造之PCBA, 以及外购入厂组立或单独包装出货之PCBA等. It fits all product(containing product and PCBA) appearance inspection, including PCBA made by self or by other company and other.3 名词解释(Words explanation)无(None)4 参考文件(Reference document) ANS/IPC-A-610D5 职责(Responsibility
4、)5.1 生产单位(Production unit):负责产品检验之执行.Be responsible for doing product inspection5.2 质量管理部(Quality unit):负责产品规格之制定及产品品质之抽样检验管制Be responsible for making product specification and controlling the spot check of product quality6 作业流程及内容(Flow chart and content )6.1检验前的准备(preparation for inspecting):检验前须先确
5、认所使用的工具,材料,胶,清洁剂等,是否合乎规定. 检验PCBA 时必须配戴防静电手套或防静电手环, 而成品有外壳部分则不在此限.Before inspecting, be sure of the tool, material, glue, cleanser, etc. Operator should have wrist strap or electrostatic glove for prevention ESD(Electronic static Discharge ), but the finished good with。6.2 若有检验标准未规范的异常现象发生时,不代表该产品允收或
6、拒收,应向值班工程师询问。It is not means the product accept or reject that the standard of inspection have some abnormal , but should feed back to engineer to confirm. 6.3 检验环境要求光线充足,以目视为主,辅以放大镜和卡尺6.4 外观检验项目基准参见附件一三。The item of cosmetic inspection standard reference Appendix 1 to 3.7 修订权限(Authority of modificat
7、ion)本规范由质量管理部工程师撰写, 经研发单位及生产单位会签, 由质量管理部最高主管核准后实施, 修改程序亦同.This criteria is prepared by Quality unit engineer and signed off with R&D(Research and Develop department )and Production unit, and then approve by Quality manager. Modify procedure as the same above.8 附件Attachment ( 含记录表单)8.1 附件一:PCBA Appen
8、dix 1: PCBA 8.2 附件二:机构类Appendix 2: Mechanical 8.3 附件三:其它Appendix 3: Other附 件 预 览 总 表附件一: PCBA类附件二: 机构类(Mechanical)附件三: 其它(Other)1 SMT零件(SMT component)1-1 焊点规格(Soldering SPEC)1-2 焊点异常(Solderingabnormal)1-3 零件损坏(Component damage)1-4 点胶(Staking adhesive gluing)1 外壳(Housing)1 标签(Label)2 托架,承座(Chassis)2
9、Barcode3 铭板(Overlay)3 包装袋(PE bag)4 散热片(Heat sink)4 外箱(Carton)5 绝缘片(Insulator)5 Housing6 螺丝,螺帽,垫片(Screw nut)7 DC series converter 系列成品外观检验标准2 Dip 零件(DIP component)2-1 焊点规格(DIP SPEC)2-2 引脚突出(Lead protrusion)2-3 通孔(PTH)2-4 插件外观(Appearance)2-5 点胶(Adhesive gluing)2-6 DIP高翘(DIP componentlifted)8 Transform
10、er9 Shielding cover 外观检验标准3 PCB3-1 marking3-2 外观(Surface appearance)3-3 焊锡性(Solderability)4 Connector, PIN & 金手指(Golden finger)5 其它(Other)5-1 螺丝(Screw)5-2 跳线(Jump)附件一: PCBA类1 SMT零件(SMT component)1-1 焊点规格(Soldering SPEC)1-1-1 Chip 零件(Chip component)DefectSide overhang (D) is greater than 50% componen
11、t termination width (W) or 50% land width (P) whichever is less零件偏移D50% W 或D50% P 拒收DefectSide overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less零件偏移D50% W 或D50% P 拒收Defect Any end overhang (B)零件超出pad 拒收DefectComponent in reserved to lacquer to g
12、o to circuit to form a short circuit零件在有保护漆之线路上造成短路拒收AcceptableEnd joint width (C) is minimum 50% of component termination width (W) or 50% land width (P) whichever is less零件焊点宽度C50%W or C50% P 允收AcceptableMaximum fillet height (E) may overhang the lend or extend onto the of the end cap metallizatio
13、n, but not extend further onto the component body锡高超过金属端,但未延伸至零件本体允收DefectSolder fillet extends onto the component body锡延伸到零件本体上拒收DefectMinimum fillet high (F) is less than 25% termination high (H), or fillet high (F) is less than 0.5mmHigh voltage capacitance minimum fillet high (F) is less than 50
14、% termination high (H), or fillet high (F) is less than 0.75mm爬锡高度 F25% H 或 F0.5mm 拒收高压电容爬锡高度 F50% H 或 F50% W or 50% P. 拒收DefectAny end overhang (B)零件超出pad 拒收AcceptableEnd joint width (C) is minimum 50% component diameter (W) or land width (P),whichever is less零件连接直径宽度C50% W or 50% P 允收AcceptableSid
15、e joint length(D) is minimum 50% length of component termination(T) or land length(S), whichever is less侧面焊点长度D50%T or 50%S 允收DefectSolder fillet extends onto the component body锡延伸到零件本体上拒收AcceptableMinimum fillet heitht(F) is solder thickness(G) plus 25% diameter(W) of the component end cap焊锡高度F25%(
16、G+W) 允收AcceptableEnd overlap(J) between the component termination and the land is minimum 50% the length of the component termination(T)零件末端与PAD重叠部分J50%T 允收DefectEnd overlap(J) is less than 50% of the length of component零件末端与PAD重叠部分J50% W 拒收DefectEnd joint width (C) is less than 50% castellation wid
17、th (W)零件末端焊点宽度 C50% W 拒收DefectMinimum side joint length (D) is less than 50% minimum fillet height (F) or land length external to package (S),whichever is less零件末端焊点长度 D50% S 或50% F 拒收DefectMinimum fillet height (F) is 25% castellation height (H)焊锡高度 F25% H 拒收DefectAny end overhang (B)零件超出pad 拒收Defe
18、ctMinimum fillet height (F) is 25% castellation height (H)焊锡高度 F50% W 拒收DefectMinimum end joint width (C) is less 50% lead Width (W)焊点宽度 C50% W 拒收DefectSide joint length(D) is less than 80% of lead length (L)焊锡长度 D4/5 L 拒收DefectSolder touches the body or end seal of high-lead configuration component
19、焊锡延伸至零件本体上或封装末端 拒收Acceptable爬锡高度: Fillet 接触到正面吃锡面 允收DefectSolder touches package body锡延伸到零件本体上 拒收AcceptableTransformer high voltage pins solder is over the A corner portion ,but ex no function pin (for all inverters, except special case) 变压器高压Pin吃锡度已达到A 处(第一弯角处) 允收Acceptable Solder is over the B por
20、tion(for all inverters, except special case) 吃锡度超出B 处 允收Defect Solder is already over the B portion, and bobbin had Been damaged by iron . Bobbin 被烙铁烫伤 拒收DefectMinimum heel fillet height (F) is less than 25% lead thickness (T)焊锡高度 F50% W 拒收DefectMinimum end joint width (C) is less than 50% lead widt
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