宽光束、高均匀性显示贴片灯珠的光学仿真设计.pdf
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1、文章编号2097-1842(2024)01-0217-09Optical simulation design of surface mounted device beads forwide beam and high uniformity displayWEIWei1*,CHENZhi-zhong4,GUOHao-zhong6,JIAChuan-yu2,FANGFang3,ZOUJun7,FANGQian1,WUYou1,SUNMing-hao1,LIQian1,KUANGYu-han1,YINQi-kai1,ZHANGGuo-yi5(1.Yancheng Teachers Universit
2、y,Jiangsu Intelligent Optoelectronic Device and Measurement andControl Engineering Research Center,Yancheng 224007,China;2.School of International Academy of Microelectronics,DongguanUniversity of Technology,Dongguan 523000,China;3.Gold Medal Analysis,Guangzhou 511338,China;4.College of Physics,Peki
3、ng University,Beijing 100871,China;5.Department,Dongguan Institute of Opto-electronics,Peking University,Dongguan 523808,China;6.Semiconductor Research Center,Hon Hai Research Institute,New Taipei city 236,China;7.Shanghai Institute of Technology,Shanghai 201418,China)*Corresponding author,E-mail:Ab
4、stract:Throughanalysingtheopticalrequirementsofwidebeamandhighuniformitylightbeads,whicharecurrentlyusedindisplays,andpackagingmicroLight-EmittingDiode(LED)chipswithanovelnon-Lambertiandistribution,werealizedtheproductionofwidebeamandhighuniformitymicro-LEDchiplightbeads.Thelightoutputefficiencyandb
5、eamangleoffixedbeadsweresimulatedusingbracketsmadeofcop-per,titanium,aluminiumandsilver,aswellasmaterialsthatwerecompletelyreflectingandabsorbing.Thesimulationswereconductedatvariousfixtureangles,packagingheights,packagingmaterials,sapphirethick-nesses,andpatternedsapphiresubstratesizes.Byadjustingt
6、hechipandpackagingparameters,wecanob-tainone,two,orthreelightbeamswithSurfaceMountedDevice(SMD)lampbeadscharacteristicsthatprovidewideangles,highuniformity,andfar-fieldlightdistribution.Thesecharacteristicscanmeetthecur-rentdisplayrequirementsforLEDandLCD.Key words:non-lambertiandistribution;lambert
7、iandistribution;displays;SMDlampbeads收稿日期:2023-07-07;修订日期:2023-08-07基金项目:2021 年的“江苏省双创博士”项目(No.JSSCBS20211145);2022 年江苏省智能光电工程研究中心省平台项目开放课题Supportedby“Dr.Shuangchuang”intheJiangsuProvincein2021(No.JSSCBS20211145);the2022openprojectofJiangsuIntelligentOptoelectronicDeviceandMeasurementandControlEngin
8、eeringResearchCen-ter第17卷第1期中国光学(中英文)Vol.17No.12024 年 1 月ChineseOpticsJan.2024宽光束、高均匀性显示贴片灯珠的光学仿真设计魏伟1*,陈志忠4,郭浩中6,贾传宇2,方方3,邹军7,房倩1,吴优1,孙铭浩1,李倩1,匡宇涵1,殷琦凯1,张国义5(1.江苏省智能光电器件与测控工程研究中心盐城师范学院,江苏盐城224007;2.东莞理工学院国际微电子学院,广东东莞523000;3.金鉴科技有限公司,广东广州511338;4.北京大学物理学院,北京100871;5.北京大学东莞光电研究院,广东东莞523808;6.半导体所鸿海研
9、究院,台湾新北236;7.上海应用技术大学,上海201418)摘要:本文通过分析目前显示器用的高均匀宽角度灯珠的光学要求,采用新型非朗伯(non-Lambertian)分布封装 Micro-LED 芯片,实现了宽光束、高均匀性的微型 LED 芯片光珠。分析了在不同封装倾角、封装高度、封装材料、封装支架材料、蓝宝石厚度和图案化蓝宝石衬底尺寸下,使用由不同封装材料(铜、钛、铝和银)和材料类型(完全反射和完全吸收)组成的支架模拟固定灯珠的光输出效率和出光角度的变化情况。研究发现通过调整材料、芯片和封装参数,可以得到一个、两个或三个光束,具有贴片灯珠的宽角度、高均匀性的远场光分布特性,满足当前 LED
10、 和 LCD 的显示要求。关 键 词:非朗伯分布;朗伯分布;显示;贴片灯珠中图分类号:O439文献标志码:Adoi:10.37188/CO.EN-2023-00171IntroductionBacklightdisplaysthatuseLight-EmittingDi-ode(LED)andLiquid-CrystalDisplay(LCD)tech-nologieshaveseveraladvantagessuchashighen-ergyefficiencyandimprovedcontrast,lowcost,anda better spliceability17.Consequent
11、ly,these dis-plays have entered a stage of rapid development.However,backlightdisplaysusingLEDandLCDtechnologieshavecertaindrawbacks,includingtheinability to be fabricated in ultra-thin formats810.This impedes the utilization of various backlightdisplays,suchaslaptopsandmobilephones,inul-trathindisp
12、laytechnology.Theterm“micro-LEDs”referstoLEDsthathavechipsizessmallerthan100m100m11.Re-searchhasshownthatmicro-LEDchipsexhibithighuniformityandwidebeamangles,therebyenablingtheir deployment in ultrathin displays.However,certain difficulties hinder the direct installation ofmicro-LEDchipsondisplayscr
13、eens.Typicalsolu-tion is to install a micro-LED chip directly on aChip-On-Board(COB),andthencreateadisplaybysplicingtheCOBorSMDLED+LCD.However,COBtechnologyhassevevaldisadvantages,includ-ing difficulties in achieving its primary opticaldesign.ManyCOB-baseddevicesusesecondaryop-ticaldesigns and lense
14、s to adjust the mixing dis-tance,whichmakesitdifficulttoachieveultrathinmixingdistances1214.Theintegrationofmicro-LEDchipsinto COBs through display technology re-mainsunderresearchandhasnotyetbeenwidelyadopted.After reviewing pre-existing technicalmethods,weproposeatechnologicalpaththatcom-binesmicr
15、o-LEDchipswithSurface-MountTech-nology(SMT)packaging to fulfil the current de-mandforultrathindisplaysandmounteddevices.AstypicalLEDsfollowtheLambertdistribution1520,theilluminationisstrongeratmid-anglesbutweak-eronbothsides.Theopticaldesignofsupplement-arylightingrequiresconsiderationofmodification
16、s218中国光学(中英文)第17卷tolightdirectionandredistributionofintensity,inconjunction with using precision optical lenseswhichposes significant challenges to image pro-cessing.Numerousstudiesrevealthatundercertainconditions2123,micro-LEDsconformtoanon-Lam-bertdistribution and have uniform light distribu-tions
17、2425.Itwouldbeadvantageoustodeveloplow-cost,standardSMDbeadsthatgeneratewide-beamandlarge-anglelightoutput.Usingthesebeadsindisplaysreducestherelianceonlensesandmixingdistances,thus providing a better display experi-ence.Theobjectiveofthisstudyistodetermineanappropriateparametersthatsatisfiestheopti
18、calre-quirementsofdisplaysthatutilizelarge-angle,high-uniformity SMT beads with micro-LED cells tominimize cell sizes and costs.In addition,micro-LEDsminimizethemixingdistanceandproduceul-trathindisplays.Toperformopticalsimulations,weimplemen-tedtheMonteCarloapproachinconjunctionwiththe ray-tracing
19、method using TracePro software.Figure1presentsadetailedillustrationofthespecif-ic model,and a schematic of the structure of theSMDlampbeadisshowninFigure2.Forthepur-poseofthisstudy,weset0asthedirectionperpen-dicular to the light-emitting plane in front of thechipanddownward.Thisstudysuggeststhatanop
20、-tical design for LED+lenses can be achievedthroughsimulationcalculationsusinganewpatchLED.The optical design technology of the novelpatchLEDcanmeetdisplayrequirementsbyredu-cingmaterialcosts,lightloss,weight,andshorten-ingthemixingdistance.Table13presentthemodelparameters.Therefractiveindicesofsapp
21、hire,N-typeGaN,MQW,P-typeGaN,andITOwere1.7,2.45,2.54,2.45,and1.5,respectively.Theabsorptioncoefficientsofsap-phire,N-type GaN,MQW,P-type GaN,and ITOwere0.004,2.3,25,2.3,and0mm1,respectively.The thicknesses of the sapphire,N-type GaN,MQW,P-typeGaN,andITOlayerswere30,6.75,0.1,0.15,and 0.3 m,respective
22、ly23,2629.Micro-LEDchipswithdiametersof10,20,30,40,and50mwerefabricated,whilesapphirebeadswithdia-metersof2,3,and4mwereconstructedashemi-sphericalmicrostructures.SMDlamp-beadholdersof5mm5mmweredesignedinteriorsfeaturingafour-sidedconicalplatforminclinedatanglesof5,15,25,35,45,55,65,75,and85.Thechips
23、izewas30m,withpackagingheightsof10,20,40,60,and80m.Bracketswerefabricatedusingvariousmaterialsincludingcopper,aluminium,sil-ver,and titanium,along with fully absorbing andfullyreflectivematerials.Therefractiveandabsorp-tionindicesofeachmaterialarelistedinTable1.Forpackaging,epoxy,PMMA,andsilicawereu
24、sedwiththeir respective refractive and absorption in-diceslistedinTable230fora30mchip.Allchipsused were micro-LEDchips with suitable pack-agingsizesinaccordancewiththe5050chippack-agingrequirements.ThestructureoftheLEDdeviceisdepictedinFigs.13.Thewave-lengthofSMDLED is 450 nm,and the distance betwee
25、n thesampleandthedetectorisabout1000mm.Tocal-culate light extraction efficiency,we divide thenumber of photons emitted to the outside of theSMDperunittimebythenumberofphotonsemit-tedbytheactiveregionperunittime.5 mm5 mmFig.1TopviewoftheLEDdevicestructurerenderedus-ingTraceProsoftwareITO 300 nmP-GaN
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- 光束 均匀 显示 贴片灯珠 光学 仿真 设计
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